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Keywords: thermal management (packaging)
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041002.
Published Online: October 24, 2011
... 24 10 2011 24 10 2011 convection heat conduction pipes thermal management (packaging) thermoelectric devices Thermal design, analysis and management cause much attention due to the increasing packaging density in the electronic packaging field. A number of analytical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2011, 3(3): 031009.
Published Online: August 12, 2011
... management (packaging) thermal resistance thermodynamics 07 01 2011 27 06 2011 12 08 2011 12 08 2011 2011 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2011, 3(1): 011002.
Published Online: March 10, 2011
... applications. 08 04 2010 24 01 2011 10 03 2011 10 03 2011 computational fluid dynamics cooling heat pipes power electronics power engineering computing power transformers system recovery thermal management (packaging) The intelligent universal transformer (IUT...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2010, 2(3): 031004.
Published Online: December 16, 2010
... energy consumption optimisation power control refrigeration thermal management (packaging) thermodynamics The removal of very high-heat fluxes, up to 1000   W / cm 2 , is required by some military and commercial electronics applications. Simultaneously, usually the electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2010, 2(2): 021004.
Published Online: October 21, 2010
... 2010 21 10 2010 21 10 2010 adsorption cooling heat pumps heat recovery thermal management (packaging) thermoelectricity thermoelectric adsorption harsh regenerative zeolite electronics cooling In several industries, application of electronic equipments/sensors...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2010, 2(1): 011008.
Published Online: September 23, 2010
... using the micro-PIV results. Using a validated CFD model, simulations predict thermal enhancements on the order of 35%. 23 02 2010 17 08 2010 23 09 2010 23 09 2010 computational fluid dynamics cooling flow simulation microchannel flow power electronics thermal management...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2009, 1(4): 041009.
Published Online: June 24, 2010
...://www.lacotech.com/products/997300658_leaktechref.pdf . 12 11 2009 21 04 2010 24 06 2010 24 06 2010 bonding processes cooling hermetic seals photolithography power semiconductor devices semiconductor device packaging thermal management (packaging) wick structure heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031006.
Published Online: March 16, 2010
... nanofluidics nanoparticles suspensions thermal conductivity thermal management (packaging) two-phase flow viscosity water 18 10 2009 22 01 2010 16 03 2010 16 03 2010 One area that has recently been explored in literature ( 2 3 ) is the use of suspensions of nanometer size...