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1-7 of 7
Keywords: heat dissipation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2025, 17(7): 071006.
Paper No: TSEA-24-1646
Published Online: April 16, 2025
... charging and discharging rates, effective cooling designs for battery packs are necessary. The current work proposes a cooling design with better heat dissipation and maximum temperature difference (ΔT max ). The design improves the reference H-type battery thermal management system (BTMS). In this system...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2025, 17(4): 041007.
Paper No: TSEA-24-1525
Published Online: February 21, 2025
... heat dissipation and prevent battery heat accumulation. Pure battery systems use the battery's heat control abilities without thermal management components. The pure PCM system uses PCMs to absorb and disperse heat, but it lacks fin structures, which may limit its efficiency under harsher situations...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. May 2024, 16(5): 051008.
Paper No: TSEA-23-1303
Published Online: March 19, 2024
...Lianfeng Ren; Le Zhang; Yifu Liang; Yujun Su; Xin Li; Yong Tang In this work, an embedded heat source vapor chamber (EHS-VC) is proposed for efficient and cost-effective heat dissipation in a limited space of aerospace electronics. The effect of the filling liquid mass and the layers of copper mesh...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031003.
Paper No: TSEA-23-1358
Published Online: January 12, 2024
... of research in the field highlights a deficiency in the exploration of potential applications of NFs for heat dissipation through pipe channels in the battery cooling process. This study puts forth a numerical analysis of the HT process in a PB under conditions of heat generation, with a special focus...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101003.
Paper No: TSEA-22-1134
Published Online: June 26, 2023
...Jia Chen; Xiaobing Zhang; Ruijie Zhu The trend of miniaturization and intgration of the electronic device has put forward higher requirements on efficiency of heat radiating, which can hardly be satisfied by the traditional forced convection heat dissipation method. In this paper, the strategy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061023.
Paper No: TSEA-20-1620
Published Online: May 12, 2021
... velocity appears near the anode. On the temperature distribution profile of the heat dissipation system, the temperature on the electric heater side was much higher than the other regions and the role of the rotated liquid metal was to homogenize the temperature of the system. To analyze the heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
Published Online: November 4, 2009
... 2008 07 09 2009 04 11 2009 04 11 2009 cooling heat sinks insulated gate bipolar transistors integrated circuit packaging thermal resistance VC heat dissipation thermal characteristic power module electronics cooling Integrated packaging technology has...