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Keywords: Electronic cooling
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2024, 16(7): 071008.
Paper No: TSEA-23-1571
Published Online: May 10, 2024
...: amohanty_me@vssut.ac.in 08 12 2023 05 04 2024 14 04 2024 10 05 2024 Graphical Abstract Figure free convection heat sink design rectangular slots Nusselt number heat transfer neck position conduction electronic cooling extended surfaces/fins heat and mass...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2024, 16(7): 071010.
Paper No: TSEA-24-1018
Published Online: May 10, 2024
... , V. V. , and Mahajan , R. L. , 2000 , “ Forced Convection in High Porosity Metal Foams ,” ASME J. Heat Transfer , 122 ( 3 ), pp. 557 – 565 . 10.1115/1.1287793 [2] Bhattacharya , A. , and Mahajan , R. L. , 2002 , “ Finned Metal Foam Heat Sinks for Electronics Cooling...
Journal Articles
Accepted Manuscript
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-23-1589
Published Online: May 3, 2024
... Email: Bingyun.jiang@zju.edu.cn Email: 2114835747@QQ.COM Email: 13793126197@163.com 19 12 2023 27 04 2024 27 04 2024 03 05 2024 Conduction Electronic Cooling Energy Systems Accepted Manuscript Not Copyedited Journal of Thermal Science and Engineering...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2024, 16(6): 061010.
Paper No: TSEA-23-1568
Published Online: April 16, 2024
... bubbles electronic cooling heat transfer enhancement The continuous advancement in the functionality and miniaturization of electronic components facilitates a rapid surge in transistor counts within microprocessors, doubling every 2 years [ 1 ] and posing a challenge to effective thermal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2024, 16(4): 041009.
Paper No: TSEA-23-1373
Published Online: February 19, 2024
... a significant role in improving the efficiency and reliability of electronic components. These findings demonstrate the potential of using the nanofluids in thermosyphons to enhance their thermal performance in electronic cooling applications. Email: jobin.jose@vit.ac.in 1 Corresponding author. Email...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2024, 16(4): 041004.
Paper No: TSEA-23-1360
Published Online: February 16, 2024
... / wetted = wetted wall Al 2 O 3 –water nanofluids branch angle performance factor branched wavy heat sink RNG k–ɛ model secondary width electronic cooling extended surfaces/fins forced convection heat and mass transfer heat transfer enhancement References [1...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031003.
Paper No: TSEA-23-1358
Published Online: January 12, 2024
... 2023 06 11 2023 12 01 2024 heat transfer nanofluids heat generation prismatic battery system heat dissipation electronic cooling energy systems heat transfer enhancement natural and mixed convection thermal systems National Research Foundation of Korea 10.13039...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021006.
Paper No: TSEA-23-1274
Published Online: November 16, 2023
... [2] Agostini , F. , Gradinger , T. , and Cottet , D. , 2014 , “ Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling ,” ASME J. Therm. Sci. Eng. Appl. , 6 ( 3 ), p. 031003 . 10.1115/1.4026184 [3] Yan , Z. , Huang , H...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091011.
Paper No: TSEA-22-1438
Published Online: July 27, 2023
...). But generally, mobile electronics cooling demands a natural convection mode without any active cooling devices. The present study considers the effect of both cooling modes on the thermal performance of FHP. Also, portable electronic devices are used at different orientations depending upon their application...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091010.
Paper No: TSEA-22-1540
Published Online: July 27, 2023
... upon reasonable request. Email: p21me018@med.svnit.ac.in 1 Corresponding author. Email: naresh@med.svnit.ac.in 05 12 2022 01 06 2023 08 06 2023 27 07 2023 electronic cooling heat sink PCM forced convection orientation experiments energy systems...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101004.
Paper No: TSEA-23-1003
Published Online: June 26, 2023
...: pengjian1@cetc.com.cn 01 01 2023 15 04 2023 16 04 2023 26 06 2023 aluminum nitride (AlN) HTCC embedded cooling microfluidic microchannel cooler electronic cooling forced convection heat and mass transfer heat transfer enhancement National Natural Science...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091005.
Paper No: TSEA-23-1053
Published Online: June 14, 2023
... vapor compression refrigeration exergy analysis harsh thermal environment thermal management system conduction electronic cooling energy efficiency heat and mass transfer heat transfer enhancement thermal systems As the industrial economy grows, the energy gap is increasing [ 1 , 2...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081009.
Paper No: TSEA-23-1056
Published Online: May 30, 2023
... thermoelectric cooler electronic cooling phase change material hotspot cooling melting and solidification micro/nanoscale heat transfer Department of Electronics and Information Technology, Ministry of Communications and Information Technology 10.13039/501100002183 MEITY-PHD-2549...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2023, 15(6): 061004.
Paper No: TSEA-22-1390
Published Online: April 3, 2023
... conductivity as high as 31,824 W/m°C, which is quite suitable for electronics cooling. Orientation study revealed that horizontal orientation is comparatively better amongst all the other orientations for AGMBHP. The data sets generated and supporting the findings of this article are obtainable from...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2023, 15(4): 041010.
Paper No: TSEA-22-1451
Published Online: February 27, 2023
... 29 09 2022 28 01 2023 01 02 2023 27 02 2023 proton exchange membrane fuel cell BOP cooling system parasitic power consumption system efficiency electronic cooling energy efficiency thermal systems Table 1 Constants used in the model Parameter, unit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011006.
Paper No: TSEA-22-1170
Published Online: September 22, 2022
...: 2303424262@qq.com 08 04 2022 30 08 2022 31 08 2022 22 09 2022 permanent magnet synchronous motor gas–liquid two phase jet cooling numerical simulation electronic cooling heat transfer enhancement jets impingement cooling two-phase flow and heat transfer...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121013.
Paper No: TSEA-22-1189
Published Online: September 22, 2022
... natural convection method forced convection decoupled method mixed convection shrouded plate finned channel electronic cooling extended surfaces/fins forced convection heat transfer enhancement natural and mixed convection thermal systems The regime of convective heat transfer is called...