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Zhong Jin
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Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
https://doi.org/10.1115/1.4051468
Published Online: September 15, 2021
View Article titled, Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
Open the PDF for Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip in another window
Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density
Journal Articles

Spatial Distribution Prediction of Steady-State Sound Field With the Ray-Tracing Method

Zhong-Jin Jiang, Tie-Jun Cui
Journal: Journal of Vibration and Acoustics
Article Type: Technical Briefs
J. Vib. Acoust. December 2008, 130(6): 064503.
https://doi.org/10.1115/1.2980385
Published Online: October 22, 2008
View Article titled, Spatial Distribution Prediction of Steady-State Sound Field With the Ray-Tracing Method
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Topics: Algorithms, Ray tracing, Steady state