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1-20 of 108
Yogendra Joshi
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Proceedings Papers
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140132
Proceedings Papers
Yunhyeok Im, Junyoung Kim, Mingeun Choi, Myriam Bouzidi, Xingchen Li, Joon Woo Kim, Ahmet Mete Muslu, Satish Kumar, Madhavan Swaminathan, Suresh K. Sitaraman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141216
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2024, 146(5): 052901.
Paper No: HT-23-1465
Published Online: April 3, 2024
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2024, 146(5): 051602.
Paper No: HT-23-1474
Published Online: March 7, 2024
Journal Articles
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021007.
Paper No: EP-23-1026
Published Online: December 6, 2023
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. February 2023, 4(1): 011003.
Paper No: JESBC-22-1016
Published Online: April 3, 2023
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Heat Mass Transfer. March 2023, 145(3): 030301.
Paper No: HT-22-1813
Published Online: February 6, 2023
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 041603.
Paper No: HT-22-1470
Published Online: February 3, 2023
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97478
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 010801.
Paper No: TSEA-22-1328
Published Online: November 10, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
Published Online: August 18, 2022
Journal Articles
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
Published Online: February 7, 2022
Proceedings Papers
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 147-149, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1151
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
Published Online: February 19, 2021
Journal Articles
Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. April 2021, 143(4): 044502.
Paper No: HT-20-1769
Published Online: February 2, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
Published Online: January 19, 2021
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2021, 143(3): 031501.
Paper No: HT-20-1115
Published Online: January 18, 2021
Proceedings Papers
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2550
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.
Paper No: JESBC-20-1004
Published Online: June 18, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
Published Online: June 4, 2020
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