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Y. T. Lin
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Proceedings Papers

Parametric Design and Reliability Analysis of WIT Wafer Level Packaging

Y. T. Lin, P. J. Tang, K. N. Chiang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 69-78, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2248
https://doi.org/10.1115/IMECE2000-2248
View Paper titled, Parametric Design and Reliability Analysis of WIT Wafer Level Packaging
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Topics: Event history analysis, Packaging, Parametric design, Semiconductor wafers, Density, Reliability, Solders, Copper, Electronic packages, Finite element methods
Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. September 2016, 138(3): 037001.
Paper No: EP-16-1057
https://doi.org/10.1115/1.4033633
Published Online: May 25, 2016
View Article titled, Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]
Open the PDF for Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ] in another window
Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders
Journal Articles

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 020804.
Paper No: EP-16-1006
https://doi.org/10.1115/1.4033069
Published Online: April 21, 2016
View Article titled, Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
Open the PDF for Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study in another window
Topics: Patents, Pressure, Sintering, Bonding, Semiconductors (Materials)
Journal Articles

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Y. T. Lin, Graduate Assistant, C. T. Peng, Graduate Assistant, K. N. Chiang, Associate Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
https://doi.org/10.1115/1.1481368
Published Online: July 26, 2002
View Article titled, Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging
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Topics: Copper, Event history analysis, Finite element methods, Flip-chip, Packaging, Reliability, Semiconductor wafers, Solders, Wire, Finite element analysis
Journal Articles

A Three-Dimensional Analysis of Particle Deposition for the Modified Chemical Vapor Deposition (MCVD) Process

Y. T. Lin, M. Choi, R. Greif
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1992, 114(3): 735–742.
https://doi.org/10.1115/1.2911342
Published Online: August 1, 1992
View Article titled, A Three-Dimensional Analysis of Particle Deposition for the Modified Chemical Vapor Deposition (MCVD) Process
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Topics: Chemical vapor deposition, Particulate matter, Flow (Dynamics), Buoyancy, Temperature, Chemical reactions, Forced convection, Geometry, High temperature, Mixed convection
Journal Articles

A Three-Dimensional Analysis of the Flow and Heat Transfer for the Modified Chemical Vapor Deposition Process Including Buoyancy, Variable Properties, and Tube Rotation

Y. T. Lin, M. Choi, R. Greif
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1991, 113(2): 400–406.
https://doi.org/10.1115/1.2910575
Published Online: May 1, 1991
View Article titled, A Three-Dimensional Analysis of the Flow and Heat Transfer for the Modified Chemical Vapor Deposition Process Including Buoyancy, Variable Properties, and Tube Rotation
Open the PDF for A Three-Dimensional Analysis of the Flow and Heat Transfer for the Modified Chemical Vapor Deposition Process Including Buoyancy, Variable Properties, and Tube Rotation in another window
Topics: Buoyancy, Chemical vapor deposition, Flow (Dynamics), Heat transfer, Rotation, Particulate matter, Temperature, Forced convection, Manufacturing, Materials processing
Journal Articles

Analysis of Buoyancy and Tube Rotation Relative to the Modified Chemical Vapor Deposition Process

M. Choi, Y. T. Lin, R. Greif
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1990, 112(4): 1063–1069.
https://doi.org/10.1115/1.2910479
Published Online: November 1, 1990
View Article titled, Analysis of Buoyancy and Tube Rotation Relative to the Modified Chemical Vapor Deposition Process
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Topics: Buoyancy, Chemical vapor deposition, Flow (Dynamics), Rotation, Convection, Particulate matter, Manufacturing, Materials processing, Mixed convection, Temperature