1-11 of 11
Xiaohua Wu
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Quick Prediction of Complex Temperature Fields Using Conditional Generative Adversarial Networks

Xiaohua Wu, Longsheng Lu, Lanzhi Liang, Xiaokang Mei, Qinghua Liang, Yilin Zhong, Zeqiang Huang, Shu Yang, Hengfei He, Yingxi Xie
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2024, 146(11): 113301.
Paper No: HT-23-1360
https://doi.org/10.1115/1.4065911
Published Online: July 20, 2024
View Article titled, Quick Prediction of Complex Temperature Fields Using Conditional Generative Adversarial Networks
Open the PDF for Quick Prediction of Complex Temperature Fields Using Conditional Generative Adversarial Networks in another window
Topics: Temperature, Heat, Generative adversarial networks
Includes: Supplementary data
Journal Articles

Analysis of Liquid Film Evaporation in Porous Particles: Toward Optimal Wick Parameters for Heat Transfer in Heat Pipes

Xiaokang Mei, Yingxi Xie, Shitong Chai, Xiaohua Wu, Longsheng Lu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2023, 145(11): 111003.
Paper No: HT-23-1046
https://doi.org/10.1115/1.4062857
Published Online: August 10, 2023
View Article titled, Analysis of Liquid Film Evaporation in Porous Particles: Toward Optimal Wick Parameters for Heat Transfer in Heat Pipes
Open the PDF for Analysis of Liquid Film Evaporation in Porous Particles: Toward Optimal Wick Parameters for Heat Transfer in Heat Pipes in another window
Topics: Evaporation, Heat transfer, Particulate matter, Thin films, Heat pipes, Liquid films, Vapors
Includes: Supplementary data
Proceedings Papers

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Xiaohua Wu, Xinyu Dou, Chao-pin Yeh, Karl Waytt
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 391-395, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1115
https://doi.org/10.1115/IMECE1997-1115
View Paper titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
Open the PDF for Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow in another window
Topics: Simulation, Solder joints, Geometry, Solders, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Proceedings Papers

Integrated Simulations of a Compressor/Combustor Assembly of a Gas Turbine Engine

Jo¨rg Schlu¨ter, Xiaohua Wu, Heinz Pitsch, Sangho Kim, Juan Alonso
Proc. ASME. GT2005, Volume 6: Turbo Expo 2005, Parts A and B, 971-982, June 6–9, 2005
Publisher: American Society of Mechanical Engineers
Paper No: GT2005-68204
https://doi.org/10.1115/GT2005-68204
View Paper titled, Integrated Simulations of a Compressor/Combustor Assembly of a Gas Turbine Engine
Open the PDF for Integrated Simulations of a Compressor/Combustor Assembly of a Gas Turbine Engine in another window
Topics: Combustion chambers, Compressors, Engineering simulation, Gas turbines, Manufacturing, Simulation, Flow (Dynamics), Turbomachinery, Engines, Geometry
Proceedings Papers

Progress in Coupled LES-RANS Computations of Gas Turbines

Jo¨rg Schlu¨ter, Xiaohua Wu, Heinz Pitsch, Sangho Kim, Juan Alonso
Proc. ASME. PVP2004, Computational Technologies for Fluid/Thermal/Structural/Chemical Systems With Industrial Applications, Volume 2, 149-158, July 25–29, 2004
Publisher: American Society of Mechanical Engineers
Paper No: PVP2004-3131
https://doi.org/10.1115/PVP2004-3131
View Paper titled, Progress in Coupled LES-RANS Computations of Gas Turbines
Open the PDF for Progress in Coupled LES-RANS Computations of Gas Turbines in another window
Topics: Computation, Gas turbines, Reynolds-averaged Navier–Stokes equations, Flow (Dynamics), Large eddy simulation, Navier-Stokes equations, Turbomachinery
Proceedings Papers

Deterministic and Statistical Reliability of Surface Mount Components

Zhengfang Qian, Xiaohua Wu, Joe Tomase
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 151-158, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39633
https://doi.org/10.1115/IMECE2002-39633
View Paper titled, Deterministic and Statistical Reliability of Surface Mount Components
Open the PDF for Deterministic and Statistical Reliability of Surface Mount Components in another window
Topics: Reliability, Surface mount components, Failure, Fatigue life, Solder joints, Crack propagation, Fracture (Materials), Geometry, Manufacturing, Solders
Proceedings Papers

Integrated Reliability Solutions for New Component Development and Designs Optimization

Xiaohua Wu, Zhengfang Qian, Yinyan Wang
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 131-137, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82320
https://doi.org/10.1115/IMECE2005-82320
View Paper titled, Integrated Reliability Solutions for New Component Development and Designs Optimization
Open the PDF for Integrated Reliability Solutions for New Component Development and Designs Optimization in another window
Topics: Optimization, Reliability, Cycles, Engineering simulation, Engines, Experimental design, Simulation, Stack design, Design, Engineering prototypes
Proceedings Papers

A Method of BGA Bump and Solder Joint Design for Optimal Solderability

Xiaohua Wu, Jay Huang, Zhengfang Qian
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 305-309, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13819
https://doi.org/10.1115/IMECE2006-13819
View Paper titled, A Method of BGA Bump and Solder Joint Design for Optimal Solderability
Open the PDF for A Method of BGA Bump and Solder Joint Design for Optimal Solderability in another window
Topics: Ball-Grid-Array packaging, Design, Solder joints, Solders, Algorithms, Design methodology, Stack design
Proceedings Papers

Integrated Reliability Solutions: A Software Tool for Mechanical Reliability of Electronic Components

Yinyan Wang, Chuntao Zhang, Xiaohua Wu, Guoshu Song, Zhengfang Qian
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 409-418, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15542
https://doi.org/10.1115/IMECE2006-15542
View Paper titled, Integrated Reliability Solutions: A Software Tool for Mechanical Reliability of Electronic Components
Open the PDF for Integrated Reliability Solutions: A Software Tool for Mechanical Reliability of Electronic Components in another window
Topics: Computer software, Electronic components, Reliability, Design, Accelerated life testing, Cycles, Innovation, Manufacturing, Modeling
Journal Articles

Boundary Layer Transition Induced by Periodic Wakes

Xiaohua Wu, Paul A. Durbin
Journal: Journal of Turbomachinery
Publisher: ASME
Article Type: Technical Papers
J. Turbomach. July 2000, 122(3): 442–449.
https://doi.org/10.1115/1.1303076
Published Online: November 1, 1998
View Article titled, Boundary Layer Transition Induced by Periodic Wakes
Open the PDF for Boundary Layer Transition Induced by Periodic Wakes in another window
Topics: Boundary layers, Turbulence, Wakes, Reynolds-averaged Navier–Stokes equations, Skin friction (Fluid dynamics), Simulation, Flow (Dynamics)
Journal Articles

Three-Dimensional Boundary Layers Over an Infinite Swept Bump and Free Wing

Xiaohua Wu, Kyle D. Squires
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. December 1995, 117(4): 605–611.
https://doi.org/10.1115/1.2817310
Published Online: December 1, 1995
View Article titled, Three-Dimensional Boundary Layers Over an Infinite Swept Bump and Free Wing
Open the PDF for Three-Dimensional Boundary Layers Over an Infinite Swept Bump and Free Wing in another window
Topics: Boundary layers, Wings, Flow (Dynamics), Pressure gradient, Wakes, Separation (Technology), Simulation results, Turbulence