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William Maltz
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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 27–29, 2020
Paper No: IPACK2020-2609
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A046, July 16–18, 2013
Paper No: IPACK2013-73237
Journal Articles
Journal Articles