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Proceedings Papers

The Effects of Channel Height on Flow Boiling of Liquid Nitrogen

W. Lu, L. C. Chow
Proc. ASME. IMECE98, Advanced Energy Systems, 495-502, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0878
https://doi.org/10.1115/IMECE1998-0878
View Paper titled, The Effects of Channel Height on Flow Boiling of Liquid Nitrogen
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Topics: Boiling, Flow (Dynamics), Nitrogen, Critical heat flux, Heat transfer, Cooling, Heat, Lumber, Printed circuit boards, Design
Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram
Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0875
https://doi.org/10.1115/IMECE1998-0875
View Paper titled, Temperature Effect on Power MOSFET Devices
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Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature
Proceedings Papers

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 243-249, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24731
https://doi.org/10.1115/IMECE2001/EPP-24731
View Paper titled, Failure Analysis of Miniature Solder Specimen
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Topics: Failure analysis, Solders, Damage, Engineering simulation, Simulation, Finite element analysis, Tension, ASTM International, ASTM standards, Constitutive equations
Journal Articles

In Situ Investigations on Failure Evolution of Overlying Strata Induced by Mining Multiple Coal Seams

Y. L. Tan, X. S. Liu, J. G. Ning, Y. W. Lu
Journal: Geotechnical Testing Journal
Publisher: ASTM International
Article Type: Research-Article
Geotech. Test. J.. March 2017, 40(2): 244–257.
Paper No: GTJ20160090
https://doi.org/10.1520/GTJ20160090
Published Online: February 28, 2017
View Article titled, In Situ Investigations on Failure Evolution of Overlying Strata Induced by Mining Multiple Coal Seams
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Proceedings Papers

Numerical Simulation of Nonlinear Flow and Heat Transfer in a Sudden Expansion and Contraction Channel

M. Yang, L. Q. Yang, W. Lu, L. Li, Q. X. Liu, Y. W. Zhang
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T11A016, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6532
https://doi.org/10.1115/MNHMT2016-6532
View Paper titled, Numerical Simulation of Nonlinear Flow and Heat Transfer in a Sudden Expansion and Contraction Channel
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Topics: Computer simulation, Flow (Dynamics), Heat transfer, Reynolds number, Bifurcation, Dimensions, Fluid dynamics, Stability
Proceedings Papers

Correlation Between the Nano-Structure and the Macro-Mechanics of the Human Intervertebral Discs

Darwesh M. K. Aladin, Kenneth M. C. Cheung, Alfonso H. W. Ngan, Danny Chan, Victor Y. L. Leung, Chwee Teck Lim, Keith D. K. Luk, William W. Lu
Proc. ASME. SBC2009, ASME 2009 Summer Bioengineering Conference, Parts A and B, 405-406, June 17–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: SBC2009-206807
https://doi.org/10.1115/SBC2009-206807
View Paper titled, Correlation Between the Nano-Structure and the Macro-Mechanics of the Human Intervertebral Discs
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Topics: Intervertebral discs, Nanostructures , Disks, Stem cells, Annulus, Biological tissues, Diseases, Patient treatment, Proteins, Stress
Journal Articles

Pool Boiling Heat Transfer Enhancement Through Nanostructures on Silicon Microchannels

Z. Yao, Y.-W. Lu, S. G. Kandlikar
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. August 2012, 3(3): 031002.
Paper No: NANO-12-1029
https://doi.org/10.1115/1.4007425
Published Online: January 18, 2013
View Article titled, Pool Boiling Heat Transfer Enhancement Through Nanostructures on Silicon Microchannels
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Topics: Boiling, Heat transfer, Microchannels, Pool boiling, Silicon, Heat flux, Bubbles
eBook
Book Cover Image

International Symposium on Information Engineering and Electronic Commerce, 3rd (IEEC 2011)

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859759
Proceedings Papers

Nano-Structure of Collagen Fibrils in Human Intervertebral Discs and Its Correlation With the Tissue Mechanics

Darwesh M. K. Aladin, Kenneth M. C. Cheung, Alfonso H. W. Ngan, Danny Chan, Victor Y. L. Leung, Chwee Teck Lim, Keith D. K. Luk, William W. Lu
Proc. ASME. NEMB2010, ASME 2010 First Global Congress on NanoEngineering for Medicine and Biology, 337-338, February 7–10, 2010
Publisher: American Society of Mechanical Engineers
Paper No: NEMB2010-13077
https://doi.org/10.1115/NEMB2010-13077
View Paper titled, Nano-Structure of Collagen Fibrils in Human Intervertebral Discs and Its Correlation With the Tissue Mechanics
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Topics: Biological tissues, Intervertebral discs, Nanostructures , Disks, Stem cells, Annulus, Diseases, Patient treatment, Proteins, Stress
Journal Articles

Flow Boiling Heat Transfer in Horizontal Metal-Foam Tubes

C. Y. Zhao, W. Lu, S. A. Tassou
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2009, 131(12): 121002.
https://doi.org/10.1115/1.3216036
Published Online: October 15, 2009
View Article titled, Flow Boiling Heat Transfer in Horizontal Metal-Foam Tubes
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Topics: Boiling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Metal foams, Vapors, Temperature, Pressure
Proceedings Papers

Analysis and Characterization of Embedded Resistors for Wideband Applications

Albert C. W. Lu, L. L. Wai, W. Fan, Stephen C. K. Wong, Toshio Yamazaki, Jacinto Jun Jarcia, Jr., Kim H. Chin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1979-1984, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73345
https://doi.org/10.1115/IPACK2005-73345
View Paper titled, Analysis and Characterization of Embedded Resistors for Wideband Applications
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Topics: Resistors, Manufacturing, Surface mount packaging, Design
Proceedings Papers

Design Optimization of Via Transitions for Broadband Applications

Albert Chee W. Lu, Wei Fan, Lai L. Wai, Lin Jin, Lee A. Low
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 17-23, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35154
https://doi.org/10.1115/IPACK2003-35154
View Paper titled, Design Optimization of Via Transitions for Broadband Applications
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Topics: Design, Optimization, Resonance, Cavities, Engineering simulation, Signals, Simulation, Vehicles, Waves
Proceedings Papers

Solution Space Analysis of High-Density Flex Substrates for 10 GE Optical Transceiver Applications

Wei Fan, Albert Chee W. Lu, Lai L. Wai, Voon Yee Ho, Douglas B. Gundel
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 37-41, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35222
https://doi.org/10.1115/IPACK2003-35222
View Paper titled, Solution Space Analysis of High-Density Flex Substrates for 10 GE Optical Transceiver Applications
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Topics: Density, Engineering simulation, Simulation, Strip transmission lines
Proceedings Papers

Design Optimization of LTCC Interconnects With Meshed Ground Planes

Lai L. Wai, Albert Chee W. Lu, Wei Fan, Lin Jin, Lee A. Low
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 7-12, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35155
https://doi.org/10.1115/IPACK2003-35155
View Paper titled, Design Optimization of LTCC Interconnects With Meshed Ground Planes
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Topics: Density, Design, Engineering simulation, Finite element methods, Finite element model, Geometry, Metals, Optimization, Simulation
Proceedings Papers

Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology

Albert Chee W. Lu, Wei Fan, Lai L. Wai, Toshiro Yamazaki, Jacinto Jun Jarcia, Jr., Kim H. Chin
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 727-733, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35221
https://doi.org/10.1115/IPACK2003-35221
View Paper titled, Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology
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Topics: Design, Optimization, Capacitors, Printed circuit boards, Engineering simulation, Frequency-domain analysis, Lumber, Simulation, Simulation results, Vehicles
Proceedings Papers

Design Optimization of Off-Chip Inductors

Lin Jin, Albert Chee W. Lu, Lai L. Wai, Wei Fan, Aik Chong Tan, Kai Chong Chan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 735-739, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35223
https://doi.org/10.1115/IPACK2003-35223
View Paper titled, Design Optimization of Off-Chip Inductors
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Topics: Design, Inductors, Optimization, Design methodology, Engineering simulation, Manufacturing, Semiconductor wafers, Simulation
Proceedings Papers

Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module

Z. F. Shi, Albert C. W. Lu, Eric Tan, Ronson Tan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 317-321, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35141
https://doi.org/10.1115/IPACK2003-35141
View Paper titled, Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module
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Topics: Cavities, Computational fluid dynamics, Computer simulation, Heat sinks, Junctions, Lasers, Optical interconnections, Performance evaluation, Robustness, Signals
eBook Chapter

Heat Transfer Enhancement for Thermal Energy Storage Using Metal Foams Embedded within Phase Change Materials (PCMS)

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2009
ISBN: 9780791802908
Open the PDF for Heat Transfer Enhancement for Thermal Energy Storage Using Metal Foams Embedded within Phase Change Materials (PCMS) in another window
Topics: Heat transfer, Metal foams, Phase change materials, Thermal energy storage
Journal Articles

Failure Analysis of Miniature Solder Specimen

Y. Wei, C. L. Chow, H. E. Fang, M. K. Neilsen, T. J. Lim, W. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
https://doi.org/10.1115/1.1648060
Published Online: April 30, 2004
View Article titled, Failure Analysis of Miniature Solder Specimen
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Topics: Damage, Failure analysis, Finite element analysis, Solders, Creep, Fatigue, Constitutive equations, Nonequilibrium thermodynamics, Stress, Displacement
Journal Articles

Nanotribological and Nanomechanical Properties of Ultrathin Amorphous Carbon Films Synthesized by Radio Frequency Sputtering

W. Lu, Graduate Student, K. Komvopoulos, Professor
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. July 2001, 123(3): 641–650.
https://doi.org/10.1115/1.1339977
Published Online: October 31, 2000
View Article titled, Nanotribological and Nanomechanical Properties of Ultrathin Amorphous Carbon Films Synthesized by Radio Frequency Sputtering
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Topics: Carbon films, Diamonds, Friction, Nanoscale phenomena, Sputtering (Irradiation), Stress, Surface roughness, Wear, Wear resistance, Mechanical properties