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Proceedings Papers

Deep Learning-Based Surrogate Modeling via Physics-Informed Artificial Image (PIAI) for Strongly Coupled Multidisciplinary Engineering Systems

Sungkun Hwang, Seung-Kyum Choi
Proc. ASME. IDETC-CIE2021, Volume 2: 41st Computers and Information in Engineering Conference (CIE), V002T02A033, August 17–19, 2021
Paper No: DETC2021-72099
https://doi.org/10.1115/DETC2021-72099
View Paper titled, Deep Learning-Based Surrogate Modeling via Physics-Informed Artificial Image (PIAI) for Strongly Coupled Multidisciplinary Engineering Systems
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Topics: Engineering systems and industry applications, Metamodeling, Physics, Design, Simulation, Cantilever beams, Computer-aided design, Engineering design, Engineering disciplines, Filters
Proceedings Papers

Optimal Design of Thermo-Compression Bonding for Advanced Packaging System Under Uncertainty

Sungkun Hwang, Seung-Kyum Choi
Proc. ASME. IDETC-CIE2019, Volume 1: 39th Computers and Information in Engineering Conference, V001T02A001, August 18–21, 2019
Paper No: DETC2019-97988
https://doi.org/10.1115/DETC2019-97988
View Paper titled, Optimal Design of Thermo-Compression Bonding for Advanced Packaging System Under Uncertainty
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Topics: Bonding, Compression, Design, Packaging, Uncertainty, Reliability, Artificial neural networks, Deformation, Electricity (Physics), Electronic components
Proceedings Papers

Optimal Design of Stretchable Electronics With the Consideration of Response Variability

Sungkun Hwang, Seung-Kyum Choi
Proc. ASME. IDETC-CIE2017, Volume 9: 13th ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications, V009T07A054, August 6–9, 2017
Paper No: DETC2017-67642
https://doi.org/10.1115/DETC2017-67642
View Paper titled, Optimal Design of Stretchable Electronics With the Consideration of Response Variability
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Topics: Design, Electronics, Artificial neural networks, Dimensions, Uncertainty, Complex systems, Engineering design processes, Manufacturing, Printing, Radar
Proceedings Papers

Reliability Estimation of Stretchable Electronics Using a Dimension Reduction Framework

Sungkun Hwang, Recep M. Gorguluarslan, Seung-Kyum Choi, Junki Min, Jack Moon
Proc. ASME. IDETC-CIE2016, Volume 1A: 36th Computers and Information in Engineering Conference, V01AT02A025, August 21–24, 2016
Paper No: DETC2016-59995
https://doi.org/10.1115/DETC2016-59995
View Paper titled, Reliability Estimation of Stretchable Electronics Using a Dimension Reduction Framework
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Topics: Dimensions, Electronics, Reliability, Artificial neural networks, Algorithms, Entropy, Feature extraction, Feature selection, Principal component analysis, Solder joints