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Proceedings Papers

Selective Use of Rubber Toughening to Optimize Lap-Joint Strength

Erol Sancaktar, Sumeet Kumar
Proc. ASME. IMECE99, Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections, 113-138, November 14–19, 1999
Paper No: IMECE1999-1191
DOI: https://doi.org/10.1115/IMECE1999-1191
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Topics: Rubber, Finite element analysis, Adhesives, Epoxy adhesives, Epoxy resins, Finite element model, Modeling, Adhesive joints, Geometry, Resins
Proceedings Papers

Integrated Rotor Performance Improvement and Vibration Reduction Using Active Camber Morphing

Sumeet Kumar, Dominik Komp, Manfred Hajek, Jürgen Rauleder
Proc. ASME. SMASIS2019, ASME 2019 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, V001T04A010, September 9–11, 2019
Paper No: SMASIS2019-5588
DOI: https://doi.org/10.1115/SMASIS2019-5588
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Topics: Rotors, Vibration, Aerodynamics, Airfoils, Blades, Stress, Bone, Control equipment, Deflection, Multibody dynamics
Proceedings Papers

Thermal Design of Thermoelectric Generators for Automobile Waste Heat Recovery

Sumeet Kumar, Stephen D. Heister, Xianfan Xu, James R. Salvador, Gregory P. Meisner
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 67-77, July 8–12, 2012
Paper No: HT2012-58129
DOI: https://doi.org/10.1115/HT2012-58129
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Topics: Automobiles, Design, Generators, Heat recovery, Temperature, Electric power generation, Exhaust systems, Fins, Flow (Dynamics), Gates (Closures)
Proceedings Papers

Thermal Modeling for Design Optimization of a Microfluidic Device for Continuous Flow Polymerase Chain Reaction (PCR)

Sumeet Kumar, Todd Thorsen, Sarit Kumar Das
Proc. ASME. HT2008, Heat Transfer: Volume 3, 323-330, August 10–14, 2008
Paper No: HT2008-56198
DOI: https://doi.org/10.1115/HT2008-56198
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Topics: Chain, Design, Flow (Dynamics), Microfluidics, Modeling, Optimization, Temperature, DNA, Plasma desorption mass spectrometry, Temperature gradient