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Proceedings Papers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Mahmoud Ibrahim, Siddharth Bhopte, Bahgat Sammakia, Bruce Murray, Madhusudan Iyengar, Roger Schmidt

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010

Paper No: IMECE2010-40914

DOI: https://doi.org/10.1115/IMECE2010-40914

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Topics: Data centers, Temperature, Buoyancy, Computer simulation, Computers, Air conditioning, Boundary-value problems, Computational fluid dynamics, Cooling, Dynamics (Mechanics)

Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011

Paper No: IPACK2011-52166

DOI: https://doi.org/10.1115/IPACK2011-52166

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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow

Proceedings Papers

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

Siddharth Bhopte, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, Nataraj Hariharan

Paper No: IPACK2011-52296

DOI: https://doi.org/10.1115/IPACK2011-52296

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Topics: Microelectromechanical systems, Solder joints, Solders, Actuators, Metals, Pressure sensors, Refrigeration, Reliability, Flow (Dynamics), Flow control

Journal Articles

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt

J. Electron. Packag. March 2011, 133(1): 011007.

DOI: https://doi.org/10.1115/1.4003603

Published Online: March 9, 2011

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Topics: Data centers, Flow (Dynamics), Pipes, Tiles, Computer simulation, Air flow

Proceedings Papers

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Siddharth Bhopte, Seshu B. Desu, Bahgat Sammakia

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 629-635, August 8–13, 2010

Paper No: IHTC14-22918

DOI: https://doi.org/10.1115/IHTC14-22918

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Topics: Electronic systems, Flat heat pipes, Heat flux, Heat, Thermal conductivity, Design, Electronic packages, Thermal management, Carbon, Dimensions

Proceedings Papers

Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 827-836, July 8–12, 2007

Paper No: IPACK2007-33540

DOI: https://doi.org/10.1115/IPACK2007-33540

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Topics: Data centers, Flow (Dynamics), Tiles, Air conditioning, Computational fluid dynamics, Pipes, Air flow, Cables, Computer simulation, Computers

Proceedings Papers

Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing

Siddharth Bhopte, Bahgat Sammakia, Bruce Murray

Proc. ASME. BIOMED2008, ASME 2008 3rd Frontiers in Biomedical Devices Conference, 19-20, June 18–20, 2008

Paper No: BioMed2008-38096

DOI: https://doi.org/10.1115/BioMed2008-38096

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Topics: Engineering design processes, Flow (Dynamics), Microchannels, Design, Microelectromechanical systems, Microfluidics, Reynolds number

Proceedings Papers

Mixing Enhancement in Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects

Siddharth Bhopte, Bahgat Sammakia, Bruce Murray

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 15-21, November 11–15, 2007

Paper No: IMECE2007-43387

DOI: https://doi.org/10.1115/IMECE2007-43387

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Topics: Flow (Dynamics), Microchannel flow, Microchannels, Cavities, Computational fluid dynamics, Geometry, Microelectromechanical systems, Microfluidics, Modeling, Reynolds number

Proceedings Papers

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 33-41, July 17–22, 2005

Paper No: IPACK2005-73027

DOI: https://doi.org/10.1115/IPACK2005-73027

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Topics: Data centers, Optimization, Temperature, Design, Tiles, Ceilings, Failure, Heat, Stress, Thermal management

Proceedings Papers

Guidelines on Managing Under Floor Blockages for Improved Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 83-91, November 5–10, 2006

Paper No: IMECE2006-13711

DOI: https://doi.org/10.1115/IMECE2006-13711

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Topics: Data centers, Flow (Dynamics), Thermal management, Tiles, Air conditioning, Air flow, Computational fluid dynamics, Computers, Cooling, Design

Proceedings Papers

Numerical Modeling of Data Center Clusters: Impact of Model Complexity

Siddharth Bhopte, Madhusudan K. Iyengar, Bahgat Sammakia, Roger Schmidt, Dereje Agonafer

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 51-60, November 5–10, 2006

Paper No: IMECE2006-13494

DOI: https://doi.org/10.1115/IMECE2006-13494

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Topics: Computer simulation, Data centers, Flow (Dynamics), Computational fluid dynamics, Computers, Tiles, Air conditioning, Air flow, Cables, Cooling

Journal Articles

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia

J. Electron. Packag. December 2006, 128(4): 380–387.

DOI: https://doi.org/10.1115/1.2356866

Published Online: January 5, 2006

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Topics: Ceilings, Data centers, Optimization, Temperature, Design

Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME

J. Electron. Packag. December 2004, 126(4): 519–523.

DOI: https://doi.org/10.1115/1.1827267

Published Online: January 24, 2005

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Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number

Journal citation

NARROW

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing

Mixing Enhancement in Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Guidelines on Managing Under Floor Blockages for Improved Data Center Performance

Numerical Modeling of Data Center Clusters: Impact of Model Complexity

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

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