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Shuv Dey
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Journal Articles

Using Multiscale Atmospheric Modeling to Explore the Impact of Surface Albedo on Anthropogenic Heat Release

Shuv Dey, Evan Mallen, Brian Stone, Jr., Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2024, 146(5): 052901.
Paper No: HT-23-1465
https://doi.org/10.1115/1.4065088
Published Online: April 3, 2024
View Article titled, Using Multiscale Atmospheric Modeling to Explore the Impact of Surface Albedo on Anthropogenic Heat Release
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Topics: Albedo, Cities, Heat, Large eddy simulation, Simulation, Temperature, Modeling, Heat flux, Boundary-value problems, Microscale devices
Journal Articles

Evaluation and Validation of Microscale Atmospheric Modeling With Offline Weather Research and Forecasting Model to Parallelized Large-Eddy Simulation Model Forcing Conditions

Shuv Dey, Evan Mallen, Brian Stone, Jr., Yogendra Joshi
Journal: ASME Journal of Engineering for Sustainable Buildings and Cities
Publisher: ASME
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. February 2023, 4(1): 011003.
Paper No: JESBC-22-1016
https://doi.org/10.1115/1.4062112
Published Online: April 3, 2023
View Article titled, Evaluation and Validation of Microscale Atmospheric Modeling With Offline Weather Research and Forecasting Model to Parallelized Large-Eddy Simulation Model Forcing Conditions
Open the PDF for Evaluation and Validation of Microscale Atmospheric Modeling With Offline Weather Research and Forecasting Model to Parallelized Large-Eddy Simulation Model Forcing Conditions in another window
Topics: Boundary-value problems, Cities, Flow (Dynamics), Heat, Large eddy simulation, Microscale devices, Modeling, Simulation, Temperature, Turbulence
Journal Articles

Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications

Shuv Dey, Yogendra Joshi
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Review Articles
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 010801.
Paper No: TSEA-22-1328
https://doi.org/10.1115/1.4056054
Published Online: November 10, 2022
View Article titled, Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications
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Topics: Cities, Heat, Modeling, Microscale devices
Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Article titled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Packaging Environmental Sensors for Monitoring Urban-Microclimates

Shuv Dey, J. Michael Brown, Yogendra Joshi
Journal: ASME Journal of Engineering for Sustainable Buildings and Cities
Publisher: ASME
Article Type: Research Papers
J. Eng. Sustain. Bldgs. Cities. August 2020, 1(3): 031001.
Paper No: JESBC-20-1004
https://doi.org/10.1115/1.4047422
Published Online: June 18, 2020
View Article titled, Packaging Environmental Sensors for Monitoring Urban-Microclimates
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Topics: Packaging, Sensors, Design
Proceedings Papers

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

Shuv Dey, Yogendra Joshi, J. Michael Brown
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6515
https://doi.org/10.1115/IPACK2019-6515
View Paper titled, Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies
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Topics: Cities, Heat, Internet of things, Packaging, Pollution, Sensor networks, Sensors