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Proceedings Papers

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

S. Shakya, S. M. Heinrich, J. Liang, P. S. Lee

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 55-63, November 16–21, 1997

Paper No: IMECE1997-0814

DOI: https://doi.org/10.1115/IMECE1997-0814

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Topics: Ball-Grid-Array packaging, Ceramics, Computer simulation, Die cutting, Disks, Displacement, Finite element analysis, Finite element methods, Flip-chip packages, Geometry

Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997

Paper No: IMECE1997-0500

DOI: https://doi.org/10.1115/IMECE1997-0500

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Proceedings Papers

Analytical Expressions for Shear and Axial Joint Deformations in Area-Array Assemblies Due to Global CTE Mismatch

S. M. Heinrich, S. Shakya, P. S. Lee, J. Liang

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 485-497, November 17–22, 2002

Paper No: IMECE2002-39636

DOI: https://doi.org/10.1115/IMECE2002-39636

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Topics: Deformation, Shear (Mechanics), Manufacturing, Corners (Structural elements), Dimensions, Materials properties, Shear deformation, Compression, Warping, Design

Journal Articles

An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

S. Shakya, S. M. Heinrich, P. S. Lee

J. Electron. Packag. March 2004, 126(1): 74–81.

DOI: https://doi.org/10.1115/1.1648058

Published Online: April 30, 2004

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Topics: Die cutting, Displacement, Manufacturing, Shear (Mechanics), Shear deformation, Shearing (Deformation), Solders, Stress, Temperature

Journal Articles

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

S. M. Heinrich, S. Shakya, J. Liang, P. S. Lee

J. Electron. Packag. December 2000, 122(4): 328–334.

DOI: https://doi.org/10.1115/1.1289631

Published Online: January 28, 2000

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Topics: Creep, Displacement, Shear (Mechanics), Stiffness, Shear deformation, Shapes, Stress, Viscoelastic materials, Viscoelasticity, Solders

Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee

J. Electron. Packag. December 1999, 121(4): 303–311.

DOI: https://doi.org/10.1115/1.2793857

Published Online: December 1, 1999

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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model

Journal Articles

Analysis of Contact Mechanics for a Circular Filamentary Brush/Workpart System

C.-Y. Shia, R. J. Stango, S. M. Heinrich

J. Manuf. Sci. Eng. November 1998, 120(4): 715–721.

DOI: https://doi.org/10.1115/1.2830211

Published Online: November 1, 1998

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Topics: Contact mechanics, Damping, Displacement, Fibers, Finite difference methods, Modeling, Transients (Dynamics)

Journal Articles

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

S. M. Heinrich, S. Shakya, P. S. Lee

J. Electron. Packag. March 1998, 120(1): 12–17.

DOI: https://doi.org/10.1115/1.2792278

Published Online: March 1, 1998

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Topics: Displacement, Solders, Die cutting, Dimensions, Shearing (Deformation), Thermal energy, Elastic moduli, High temperature, Manufacturing, Relaxation (Physics)

Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

J. Electron. Packag. March 1998, 120(1): 18–23.

DOI: https://doi.org/10.1115/1.2792279

Published Online: March 1, 1998

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Journal Articles

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee

J. Electron. Packag. December 1997, 119(4): 218–227.

DOI: https://doi.org/10.1115/1.2792240

Published Online: December 1, 1997

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Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis

Journal Articles

Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

A. F. Elkouh, N. Ramasubramanian, T. F. Hsu, N. J. Nigro, S. M. Heinrich, P. S. Lee, D. Shangguan

J. Electron. Packag. December 1997, 119(4): 268–274.

DOI: https://doi.org/10.1115/1.2792248

Published Online: December 1, 1997

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Topics: Geometry, Solders, Solder joints, Differential equations, Printed circuit boards

Journal Articles

Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints

N. J. Nigro, F. J. Zhou, S. M. Heinrich, A. F. Elkouh, R. A. Fournelle, P. S. Lee

J. Electron. Packag. September 1996, 118(3): 142–147.

DOI: https://doi.org/10.1115/1.2792144

Published Online: September 1, 1996

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Topics: Finite element methods, Shapes, Solder joints, Boundary-value problems, Finite element analysis, Interpolation, Potential energy, Solders

Journal Articles

Prediction of Solder Joint Geometries in Array-Type Interconnects

S. M. Heinrich, M. Schaefer, S. A. Schroeder, P. S. Lee

J. Electron. Packag. September 1996, 118(3): 114–121.

DOI: https://doi.org/10.1115/1.2792140

Published Online: September 1, 1996

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Topics: Solder joints, Solders, Reliability, Shapes, Surface tension, Engineers, Fatigue, Flip-chip, Geometry, Necking

Journal Articles

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee

J. Electron. Packag. December 1993, 115(4): 433–439.

DOI: https://doi.org/10.1115/1.2909353

Published Online: December 1, 1993

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Topics: Geometry, Solder joints, Solders, Density, Gravity (Force), Printed circuit boards, Computer software, Computers, Design, Engineers

Journal Articles

Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

N. J. Nigro, S. M. Heinrich, A. F. Elkouh, X. Zou, R. Fournelle, Ping S. Lee

J. Electron. Packag. June 1993, 115(2): 141–146.

DOI: https://doi.org/10.1115/1.2909309

Published Online: June 1, 1993

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Topics: Equilibrium (Physics), Finite element methods, Shapes, Solder joints, Finite element analysis, Potential energy, Interpolation, Stress, Surface mount packaging, Theorems (Mathematics)

Journal Articles

Variational Methods in Mechanics

Toshio Mura, Author, Tatsuhito Koya, Author, S. M. Heinrich, Reviewer

J. Pressure Vessel Technol. February 1993, 115(1): 102–103.

DOI: https://doi.org/10.1115/1.2929487

Published Online: February 1, 1993

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Topics: Variational techniques

Journal Articles

Effect of Workpart Curvature on the Stiffness Properties of Circular Filamentary Brushes

S. M. Heinrich, R. J. Stango, Chih Yuan Shia

J. Manuf. Sci. Eng. August 1991, 113(3): 276–282.

DOI: https://doi.org/10.1115/1.2899697

Published Online: August 1, 1991

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Topics: Stiffness, Deformation, Geometry, Kinematics

Journal Articles

Solder Joint Formation in Surface Mount Technology—Part II: Design

S. M. Heinrich, N. J. Nigro, A. F. Elkouh, P. S. Lee

J. Electron. Packag. September 1990, 112(3): 219–222.

DOI: https://doi.org/10.1115/1.2904370

Published Online: September 1, 1990

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Topics: Design, Solder joints, Surface mount technology, Surface tension, Density, Dimensions, Solders, Surface mount packaging

Journal Articles

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

S. M. Heinrich, A. F. Elkouh, N. J. Nigro, Ping S. Lee

J. Electron. Packag. September 1990, 112(3): 210–218.

DOI: https://doi.org/10.1115/1.2904369

Published Online: September 1, 1990

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Topics: Solder joints, Surface mount technology, Solders, Density, Dimensions, Shapes, Surface mount packaging, Surface tension

Journal Articles

Analysis of Constrained Filament Deformation and Stiffness Properties of Brushes

R. J. Stango, S. M. Heinrich, C. Y. Shia

J. Manuf. Sci. Eng. August 1989, 111(3): 238–243.

DOI: https://doi.org/10.1115/1.3188755

Published Online: August 1, 1989

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Topics: Deformation, Stiffness, Displacement, Finishes, Kinematics

Journal citation

NARROW

Assessment of an Axisymmetric Analytical Model of a Square Areal Array Assembly

Shearing Deformation in Partial Areal Arrays: Analytical Results

Analytical Expressions for Shear and Axial Joint Deformations in Area-Array Assemblies Due to Global CTE Mismatch

An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

Analysis of Contact Mechanics for a Circular Filamentary Brush/Workpart System

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

Shearing Deformation in Partial Areal Arrays: Analytical Results

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints

Prediction of Solder Joint Geometries in Array-Type Interconnects

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

Variational Methods in Mechanics

Effect of Workpart Curvature on the Stiffness Properties of Circular Filamentary Brushes

Solder Joint Formation in Surface Mount Technology—Part II: Design

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

Analysis of Constrained Filament Deformation and Stiffness Properties of Brushes

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