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Journal Articles

Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

Hongyi Xiang, Haoxiang Wang, Renke Kang, Shang Gao

Publisher: ASME

J. Manuf. Sci. Eng. July 2024, 146(7): 071007.

Paper No: MANU-23-1619

https://doi.org/10.1115/1.4065455

Published Online: May 23, 2024

View Article titled, Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

Topics: Brittleness, Grinding, Semiconductor wafers, Silicon carbide, Surface roughness, Cutting, Grinding wheels

Journal Articles

Why Parallelism of Workpieces Becomes Convergent During Double-Sided Lapping?

Bo Pan, Renke Kang, Xu Zhu, Zhe Yang, Juntao Zhang, Jiang Guo

Publisher: ASME

J. Manuf. Sci. Eng. July 2023, 145(7): 074501.

Paper No: MANU-22-1445

https://doi.org/10.1115/1.4057053

Published Online: March 29, 2023

View Article titled, Why Parallelism of Workpieces Becomes Convergent During Double-Sided Lapping?

Topics: Grinding, Machining, Pressure

Journal Articles

Study on Machining Quality of Aluminum Honeycomb in Ultrasonic Cutting by Disc Cutter

Jiansong Sun, Renke Kang, Jialin Guo, Zhigang Dong, Yidan Wang

Publisher: ASME

J. Manuf. Sci. Eng. May 2023, 145(5): 051009.

Paper No: MANU-22-1547

https://doi.org/10.1115/1.4056667

Published Online: January 30, 2023

View Article titled, Study on Machining Quality of Aluminum Honeycomb in Ultrasonic Cutting by Disc Cutter

Topics: Aluminum, Cutting, Disks, Honeycomb structures, Machining

Journal Articles

Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiC f /SiC Composites

Zhigang Dong, Haitao Zhang, Yan Bao, Feng Yang, Zhongwang Wang, Renke Kang

Publisher: ASME

J. Manuf. Sci. Eng. May 2023, 145(5): 051008.

Paper No: MANU-22-1387

https://doi.org/10.1115/1.4056595

Published Online: January 30, 2023

View Article titled, Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiC f /SiC Composites

Topics: Composite materials, Fibers, Fracture (Materials), Fracture (Process), Grinding, Surface quality, Surface topography, Vibration, Surface roughness, Grinding wheels

Journal Articles

Adaptive Process Planning for Additive/Subtractive Hybrid Manufacturing of Overhang Features

Qian Bai, Yingming Gao, Guowen Qiao, Renke Kang, Yingwei Zhang

Publisher: ASME

J. Manuf. Sci. Eng. February 2023, 145(2): 021010.

Paper No: MANU-21-1486

https://doi.org/10.1115/1.4055892

Published Online: October 19, 2022

View Article titled, Adaptive Process Planning for Additive/Subtractive Hybrid Manufacturing of Overhang Features

Topics: Manufacturing, Milling, Production planning, Slabs, Surface quality, Collisions (Physics), Propellers, Lasers, Machining, Finishes

Journal Articles

Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten

Hao Wang, Xiaoguang Guo, Zhigang Dong, Song Yuan, Yan Bao, Renke Kang

Publisher: ASME

J. Manuf. Sci. Eng. November 2022, 144(11): 111008.

Paper No: MANU-21-1519

https://doi.org/10.1115/1.4054839

Published Online: July 26, 2022

View Article titled, Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten

Topics: Cutting, Damage, Dislocations, Tungsten, Crystals

Journal Articles

Development and Optimization of Ultrasonic Elliptical Vibration Cutting Device Based on Single Excitation

Sen Yin, Zhigang Dong, Yan Bao, Renke Kang, Wenhao Du, Yanan Pan, Zhuji Jin

Publisher: ASME

J. Manuf. Sci. Eng. August 2021, 143(8): 081005.

Paper No: MANU-20-1643

https://doi.org/10.1115/1.4049965

Published Online: March 26, 2021

View Article titled, Development and Optimization of Ultrasonic Elliptical Vibration Cutting Device Based on Single Excitation

Topics: Cutting, Excitation, Vibration, Optimization

Journal Articles

A Novel Method of Blade-Inclined Ultrasonic Cutting Nomex Honeycomb Core With Straight Blade

Yidan Wang, Renke Kang, Zhigang Dong, Xuanping Wang, Dehong Huo, Xun Zhang

Publisher: ASME

J. Manuf. Sci. Eng. April 2021, 143(4): 041012.

Paper No: MANU-20-1556

https://doi.org/10.1115/1.4049475

Published Online: February 25, 2021

View Article titled, A Novel Method of Blade-Inclined Ultrasonic Cutting Nomex Honeycomb Core With Straight Blade

Topics: Blades, Cutting, Honeycomb structures, Machining, Geometry

Journal Articles

Influence of the Planetary Movement of Tool on the Aspect Ratio of Micro Holes Machined by Micro-Ultrasonic Machining

Senwang Lei, Zuyuan Yu, Kai Zhou, Jianzhong Li, Renke Kang

Publisher: ASME

J. Micro Nano-Manuf. March 2019, 7(1): 010905.

Paper No: JMNM-18-1056

https://doi.org/10.1115/1.4043171

Published Online: April 11, 2019

View Article titled, Influence of the Planetary Movement of Tool on the Aspect Ratio of Micro Holes Machined by Micro-Ultrasonic Machining

Topics: Machining

Journal Articles

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Bin Lin, Ping Zhou, Ziguang Wang, Ying Yan, Renke Kang, Dongming Guo

Publisher: ASME

J. Manuf. Sci. Eng. December 2018, 140(12): 121001.

Paper No: MANU-18-1118

https://doi.org/10.1115/1.4041245

Published Online: September 17, 2018

View Article titled, Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Topics: Cutting, Grinding, Grinding wheels, Semiconductor wafers, Surface roughness

Journal Articles

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Ping Zhou, Ying Yan, Ning Huang, Ziguang Wang, Renke Kang, Dongming Guo

Publisher: ASME

J. Manuf. Sci. Eng. August 2017, 139(8): 081012.

Paper No: MANU-16-1608

https://doi.org/10.1115/1.4036125

Published Online: May 10, 2017

View Article titled, Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Topics: Deformation, Diamonds, Grinding, Semiconductor wafers, Stress, Wheels, Stress concentration, Damage, Silicon

Journal Articles

Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method

Ping Zhou, Dongming Guo, Renke Kang, Zhuji Jin

Publisher: ASME

J. Tribol. January 2012, 134(1): 012201.

https://doi.org/10.1115/1.4005517

Published Online: February 9, 2012

View Article titled, Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method

Topics: Flow (Dynamics), Lattice Boltzmann methods, Polishing, Surface roughness, Simulation

Proceedings Papers

Experimental Investigation on Diamond Drilling of Potassium Di-Hydrogen Phosphate (KDP) Crystal

Qiangguo Wang, Z. J. Pei, Hang Gao, N. J. Churi, Renke Kang

Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 1, 457-464, October 7–10, 2008

Publisher: American Society of Mechanical Engineers

Paper No: MSEC_ICM&P2008-72489

https://doi.org/10.1115/MSEC_ICMP2008-72489

View Paper titled, Experimental Investigation on Diamond Drilling of Potassium Di-Hydrogen Phosphate (KDP) Crystal

Topics: Crystals, Diamonds, Drilling, Grinding, Hydrogen, Machining, Potassium, Surface roughness, Vibration

Journal citation

NARROW

Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

Why Parallelism of Workpieces Becomes Convergent During Double-Sided Lapping?

Study on Machining Quality of Aluminum Honeycomb in Ultrasonic Cutting by Disc Cutter

Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiC f /SiC Composites

Adaptive Process Planning for Additive/Subtractive Hybrid Manufacturing of Overhang Features

Effects of Cutting Force on Formation of Subsurface Damage During Nano-Cutting of Single-Crystal Tungsten

Development and Optimization of Ultrasonic Elliptical Vibration Cutting Device Based on Single Excitation

A Novel Method of Blade-Inclined Ultrasonic Cutting Nomex Honeycomb Core With Straight Blade

Influence of the Planetary Movement of Tool on the Aspect Ratio of Micro Holes Machined by Micro-Ultrasonic Machining

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method

Experimental Investigation on Diamond Drilling of Potassium Di-Hydrogen Phosphate (KDP) Crystal

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