1-6 of 6
Reena Cole
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Pressure Induced Strain at Femoral Artery Bypass Graft Junctions

Triona Campbell, Reena Cole, Michael O’Donnell
Proc. ASME. SBC2007, ASME 2007 Summer Bioengineering Conference, 1057-1058, June 20–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: SBC2007-176342
https://doi.org/10.1115/SBC2007-176342
View Paper titled, Pressure Induced Strain at Femoral Artery Bypass Graft Junctions
Open the PDF for Pressure Induced Strain at Femoral Artery Bypass Graft Junctions in another window
Topics: Junctions, Pressure, Shear stress, Atherosclerosis, Blood, Blood flow, Diseases, Failure, Shear (Mechanics), Stress
Proceedings Papers

Pressure Induced Stresses and Strains in a Simulated Femoral Artery Bypass Graft Junction

Reena Cole, Triona M. Campbell, Mark R. D. Davies
Proc. ASME. IMECE2003, Advances in Bioengineering, 109-110, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42947
https://doi.org/10.1115/IMECE2003-42947
View Paper titled, Pressure Induced Stresses and Strains in a Simulated Femoral Artery Bypass Graft Junction
Open the PDF for Pressure Induced Stresses and Strains in a Simulated Femoral Artery Bypass Graft Junction in another window
Topics: Junctions, Pressure, Stress, Modeling, Computer simulation, Cylinders, Experimental methods, Finite element analysis, Materials properties, Muscle
Proceedings Papers

Stress Distributions Along the Inner Wall of the Femoropopliteal Bypass Graft Anastomoses

Triona Campbell, Reena Cole, Mark Davies, Michael O’Donnell
Proc. ASME. IMECE2004, Advances in Bioengineering, 9-10, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59395
https://doi.org/10.1115/IMECE2004-59395
View Paper titled, Stress Distributions Along the Inner Wall of the Femoropopliteal Bypass Graft Anastomoses
Open the PDF for Stress Distributions Along the Inner Wall of the Femoropopliteal Bypass Graft Anastomoses in another window
Topics: Stress, Atherosclerosis, Damage, Junctions, Pressure, Computer simulation, Failure, Shear stress
Journal Articles

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

Reena Cole, Mark Davies, Jeff Punch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 480–489.
https://doi.org/10.1115/1.1604811
Published Online: December 15, 2003
View Article titled, A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements
Open the PDF for A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements in another window
Topics: Flat plates, Flow (Dynamics), Temperature, Thermal conductivity, Thermal resistance, Vehicles, Reynolds number, Boundary layers, Junctions, Measurement systems
Journal Articles

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 120–126.
https://doi.org/10.1115/1.1339822
Published Online: July 21, 2000
View Article titled, Forced Convection Board Level Thermal Design Methodology for Electronic Systems
Open the PDF for Forced Convection Board Level Thermal Design Methodology for Electronic Systems in another window
Topics: Design, Design methodology, Electronic systems, Flow (Dynamics), Forced convection, Temperature, Thermal resistance, Junctions, Reynolds number, Reliability
Journal Articles

Factors Affecting the Operational Thermal Resistance of Electronic Components

Mark R. D. Davies, Reena Cole, John Lohan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 185–191.
https://doi.org/10.1115/1.1286101
Published Online: November 15, 1999
View Article titled, Factors Affecting the Operational Thermal Resistance of Electronic Components
Open the PDF for Factors Affecting the Operational Thermal Resistance of Electronic Components in another window
Topics: Electronic components, Temperature, Thermal resistance, Junctions