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Journal Articles

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041010.
Paper No: EP-21-1030
https://doi.org/10.1115/1.4053309
Published Online: January 28, 2022
View Article titled, Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
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Topics: Failure, Shear (Mechanics), Testing, Finite element analysis
Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021008.
Paper No: EP-19-1006
https://doi.org/10.1115/1.4046555
Published Online: March 18, 2020
View Article titled, Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Proceedings Papers

Modeling of Smart Heat Pump Using Thermoelectric and Electrocaloric Materials

Dudong Feng, Shi-chune Yao, Tian Zhang, Qiming Zhang
Proc. ASME. SMASIS2016, Volume 1: Multifunctional Materials; Mechanics and Behavior of Active Materials; Integrated System Design and Implementation; Structural Health Monitoring, V001T04A003, September 28–30, 2016
Paper No: SMASIS2016-9033
https://doi.org/10.1115/SMASIS2016-9033
View Paper titled, Modeling of Smart Heat Pump Using Thermoelectric and Electrocaloric Materials
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Topics: Heat pumps, Modeling, Temperature, Cooling, Electric current, Electronics, Flow (Dynamics), Heat
Journal Articles

Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials

Dudong Feng, Shi-Chune Yao, Tian Zhang, Qiming Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041004.
Paper No: EP-16-1089
https://doi.org/10.1115/1.4034751
Published Online: October 6, 2016
View Article titled, Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials
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Topics: Cooling, Heat, Heat pumps, Temperature, Insulation, Wave functions