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Palash V. Acharya
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Journal Articles
Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
Published Online: November 5, 2021
Topics:
Algorithms,
Artificial neural networks,
Bridges (Structures),
Cooling,
Heat sinks,
Junctions,
Machine learning,
Machinery,
Simulation,
Steady state
Includes: Supplementary data
Proceedings Papers
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T08A003, June 16–18, 2021
Paper No: HT2021-62231
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 7–9, 2019
Paper No: IPACK2019-6311
Proceedings Papers
Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T06A006, June 10–13, 2018
Paper No: ICNMM2018-7720
Proceedings Papers
Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A004, June 10–13, 2018
Paper No: ICNMM2018-7721
Proceedings Papers
Proc. ASME. IMECE2017, Volume 8: Heat Transfer and Thermal Engineering, V008T10A077, November 3–9, 2017
Paper No: IMECE2017-70206
Proceedings Papers
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T14A007, July 9–12, 2017
Paper No: HT2017-4812