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Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013

Paper No: IPACK2013-73164

DOI: https://doi.org/10.1115/IPACK2013-73164

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Topics: Creep, Micromechanics (Engineering), Solders, Tin, Nanoscale phenomena, Solder joints, Alloys, Image processing, Intermetallic compounds, Particulate matter

Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht

J. Electron. Packag. June 2012, 134(2): 021009.

DOI: https://doi.org/10.1115/1.4006704

Published Online: June 11, 2012

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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms

Proceedings Papers

Design for Reliability of Refrigerator Components Subject to Repetitive Loads in Use

Seong-woo Woo, Dennis L. O’Neal, Michael Pecht, Hyoung-Eui Kim

Proc. ASME. IMECE2010, Volume 11: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems, 235-242, November 12–18, 2010

Paper No: IMECE2010-37134

DOI: https://doi.org/10.1115/IMECE2010-37134

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Topics: Design, Reliability, Stress, Corrective actions, Failure, Life testing, Food products, Fracture (Process)

Proceedings Papers

Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions

Shilin Liu, Qiang Yu, Michael Pecht

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 201-205, July 6–8, 2011

Paper No: IPACK2011-52111

DOI: https://doi.org/10.1115/IPACK2011-52111

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Topics: Reliability, Stress, Accounting, Electronic components, Fatigue life, Semiconductors (Materials)

Proceedings Papers

Evaluation of Robust Covariance Estimation Techniques for Anomaly Detection of Insulated Gate Bipolar Transistors (IGBT)

Nishad Patil, Sandeep Menon, Diganta Das, Michael Pecht

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 769-773, September 28–October 1, 2010

Paper No: SMASIS2010-3861

DOI: https://doi.org/10.1115/SMASIS2010-3861

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Topics: Failure, Gates (Closures), Stress, Transistors

Proceedings Papers

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010

Paper No: SMASIS2010-3864

DOI: https://doi.org/10.1115/SMASIS2010-3864

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Topics: Capacitors, Temperature, Failure, Failure mechanisms, Insulation, Capacitance, Laminates, Printed circuit boards, Composite materials, Energy dissipation

Proceedings Papers

A Radio Frequency Sensor System for Prognostics and Health Management

Shunfeng Cheng, Larry Thomas, Jason L. Cook, Michael Pecht

Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1317-1322, August 30–September 2, 2009

Paper No: DETC2009-87723

DOI: https://doi.org/10.1115/DETC2009-87723

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Topics: Sensors, Algorithms, Computers, Failure

Proceedings Papers

Identification of Failure Precursor Parameters for Cooling Fans

Hyunseok Oh, Tadahiro Shibutani, Michael Pecht

Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1253-1258, August 30–September 2, 2009

Paper No: DETC2009-86280

DOI: https://doi.org/10.1115/DETC2009-86280

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Topics: Cooling, Failure, Fans, Reliability, Testing, Acoustics, Ball bearings, Electronic equipment, Failure mechanisms, Military systems

Proceedings Papers

Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

Vikram Srinivas, Moustafa Al-Bassyiouni, Michael Osterman, Michael Pecht

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 211-216, November 13–19, 2009

Paper No: IMECE2009-11376

DOI: https://doi.org/10.1115/IMECE2009-11376

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Topics: Lead-free solders, Reliability, Resistors, Stress, Torsion

Proceedings Papers

Physics of Failure Based Virtual Testing of Communications Hardware

Elviz George, Diganta Das, Michael Osterman, Michael Pecht, Christopher Otte

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 191-197, November 13–19, 2009

Paper No: IMECE2009-12181

DOI: https://doi.org/10.1115/IMECE2009-12181

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Topics: Failure, Hardware, Physics, Testing, Design, Simulation, Computer software, Cycles, Reliability, Vibration

Proceedings Papers

Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors

Preeti Chauhan, Michael Osterman, Michael Pecht

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 199-210, November 13–19, 2009

Paper No: IMECE2009-10169

DOI: https://doi.org/10.1115/IMECE2009-10169

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Topics: Intermetallic compounds, Lead-free solders, Resistors, Tin, Solders, Temperature, Copper, High temperature, Manufacturing, Reliability

Proceedings Papers

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

Vinh Khuu, Michael Osterman, Avram Bar-Cohen, Michael Pecht

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 405-414, July 8–12, 2007

Paper No: IPACK2007-33554

DOI: https://doi.org/10.1115/IPACK2007-33554

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Topics: Lasers, Heat, Composite materials, Thermal resistance, Acoustics, Adhesives, Algorithms, Cracking (Materials), Delamination, Electronic packages

Proceedings Papers

Sensor System Selection for Prognostics and Health Monitoring

Shunfeng Cheng, Michael Azarian, Michael Pecht

Proc. ASME. IDETC-CIE2008, Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B, 1383-1389, August 3–6, 2008

Paper No: DETC2008-49907

DOI: https://doi.org/10.1115/DETC2008-49907

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Topics: Sensors, Data collection

Proceedings Papers

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Eric Stellrecht, Bongtae Han, Michael Pecht

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003

Paper No: IPACK2003-35252

DOI: https://doi.org/10.1115/IPACK2003-35252

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Topics: Proton exchange membranes, Reliability

Proceedings Papers

Auditing the Reliability Capability of Electronics Manufacturers

Sanjay Tiku, Michael Pecht

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 947-953, July 6–11, 2003

Paper No: IPACK2003-35359

DOI: https://doi.org/10.1115/IPACK2003-35359

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Topics: Electronics, Reliability, Supply chains

Proceedings Papers

Methods for Predicting the Remaining Life of Electronic Assemblies With Carbon Nanotubes and an Optical Transduction Technique

Paul Casey, Sanka Ganesan, Michael Pecht, Davinder K. Anand

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 407-415, November 15–21, 2003

Paper No: IMECE2003-41682

DOI: https://doi.org/10.1115/IMECE2003-41682

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Topics: Carbon nanotubes, Circuits, Cycles, Damage, Failure data, Fibers, Manufacturing, Nanotubes, Optical fiber, Sensors

Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Joseph Varghese, Bo Song, Michael H. Azarian, Abhijit Dasgupta, Michael Pecht

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 5–11, 2005

Paper No: IMECE2005-82428

DOI: https://doi.org/10.1115/IMECE2005-82428

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Topics: Ball-Grid-Array packaging, Electrical wires, Failure, Intermetallic compounds, Testing

Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee

J. Electron. Packag. December 2006, 128(4): 339–345.

DOI: https://doi.org/10.1115/1.2351897

Published Online: January 8, 2006

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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure

Journal citation

NARROW

Lithium-Ion Battery Strain Gauge Monitoring and Depth of Discharge Estimation

Intermittent Failures in Hardware and Software

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Design for Reliability of Refrigerator Components Subject to Repetitive Loads in Use

Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions

Evaluation of Robust Covariance Estimation Techniques for Anomaly Detection of Insulated Gate Bipolar Transistors (IGBT)

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

A Radio Frequency Sensor System for Prognostics and Health Management

Identification of Failure Precursor Parameters for Cooling Fans

Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

Physics of Failure Based Virtual Testing of Communications Hardware

Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

Sensor System Selection for Prognostics and Health Monitoring

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability

Auditing the Reliability Capability of Electronics Manufacturers

Methods for Predicting the Remaining Life of Electronic Assemblies With Carbon Nanotubes and an Optical Transduction Technique

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

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