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Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Paper No: IPACK2015-48154
DOI: https://doi.org/10.1115/IPACK2015-48154
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A020, July 16–18, 2013
Paper No: IPACK2013-73217
DOI: https://doi.org/10.1115/IPACK2013-73217
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Topics: Data centers, Steady state, Flow (Dynamics), Temperature, Buoyancy, Dynamic models, Energy dissipation, Failure, Air flow, Approximation
Proceedings Papers

Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate

John Fernandes, Saeed Ghalambor, Akhil Docca, Chris Aldham, Dereje Agonafer, Evan Chenelly, Benson Chan, Michael Ellsworth, Jr.
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A053, July 16–18, 2013
Paper No: IPACK2013-73294
DOI: https://doi.org/10.1115/IPACK2013-73294
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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Modeling, Multi-chip modules
Proceedings Papers

Experimental and Computational Characterization of a Heat Sink Tester

Aalok Trivedi, Nikhil Lakhkar, Madhusudhan Iyengar, Michael Ellsworth, Jr., Roger Schmidt, Dereje Agonafer
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 643-652, July 8–12, 2007
Paper No: IPACK2007-33975
DOI: https://doi.org/10.1115/IPACK2007-33975
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Topics: Heat sinks, Uncertainty analysis
Proceedings Papers

Design and Analysis of Direct Liquid Multi-Jet Impingement Schemes for Electronics Applications

Madhusudan Iyengar, Michael Ellsworth, Jr.
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 249-256, November 13–19, 2004
Paper No: IMECE2004-61495
DOI: https://doi.org/10.1115/IMECE2004-61495
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Topics: Design, Electronics, Water, Cooling, Computational fluid dynamics, Coolants, Flow (Dynamics), Thermal resistance, Computers, Density
Proceedings Papers

Design of a Cold Plate Tester for Accurate Measurement of Thermal Performance

Nikhil Lakhkar, Madhusudan Iyengar, Michael Ellsworth, Jr., Dereje Agonafer
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 531-539, November 5–11, 2005
Paper No: IMECE2005-81553
DOI: https://doi.org/10.1115/IMECE2005-81553
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Topics: Design, Uncertainty analysis, Errors, Plates (structures), Thermal resistance, Computers, Energy dissipation, Heat, Heat flux, Heat sinks