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Madhusudan Iyengar
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Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
DOI: https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
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Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Proceedings Papers

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Paper No: IPACK2019-6539
DOI: https://doi.org/10.1115/IPACK2019-6539
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Topics: Bonding, Cooling, Lasers, Manifolds, Microchannels, Microfabrication, Micromachining, Silicon
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
DOI: https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Proceedings Papers

System-Level Design for Liquid Cooled Chiller-Less Data Center

Pritish R. Parida, Timothy Chainer, Madhusudan Iyengar, Milnes David, Mark Schultz, Michael Gaynes, Vinod Kamath, Bejoy Kochuparambil, Robert Simons, Roger Schmidt
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1127-1139, November 9–15, 2012
Paper No: IMECE2012-88957
DOI: https://doi.org/10.1115/IMECE2012-88957
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Topics: Data centers, Design, Cooling, Energy consumption, Air conditioning, Computer simulation, Computers, Electronics, Refrigeration, Test facilities
Proceedings Papers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Mahmoud Ibrahim, Siddharth Bhopte, Bahgat Sammakia, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010
Paper No: IMECE2010-40914
DOI: https://doi.org/10.1115/IMECE2010-40914
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Topics: Data centers, Temperature, Buoyancy, Computer simulation, Computers, Air conditioning, Boundary-value problems, Computational fluid dynamics, Cooling, Dynamics (Mechanics)
Proceedings Papers

Energy Savings Through Hot and Cold Aisle Containment Configurations for Air Cooled Servers in Data Centers

Roger Schmidt, Aparna Vallury, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 611-616, July 6–8, 2011
Paper No: IPACK2011-52206
DOI: https://doi.org/10.1115/IPACK2011-52206
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Topics: Containment, Data centers
Proceedings Papers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Paper No: IPACK2011-52207
DOI: https://doi.org/10.1115/IPACK2011-52207
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Topics: Energy consumption, Experimental characterization, Server racks, Temperature, Doors, Heat exchangers, Data centers, Stress, Algorithms, Cooling
Proceedings Papers

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011
Paper No: IPACK2011-52210
DOI: https://doi.org/10.1115/IPACK2011-52210
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Topics: Data centers, Evaporative cooling, Cooling, Temperature, Climate, Computers, Energy consumption, Air conditioning, Evaporation, Filtration
Proceedings Papers

Design of Simulated Server Racks for Data Center Research

James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 415-422, July 6–8, 2011
Paper No: IPACK2011-52016
DOI: https://doi.org/10.1115/IPACK2011-52016
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Topics: Data centers, Design, Server racks, Computers, Fans, Heating, Temperature, Density, Flow (Dynamics), Pressure drop
Proceedings Papers

Characterization of a Server Thermal Mass Using Experimental Measurements

Mahmoud Ibrahim, Furat Afram, Bahgat Sammakia, Kanad Ghose, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 577-583, July 6–8, 2011
Paper No: IPACK2011-52165
DOI: https://doi.org/10.1115/IPACK2011-52165
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Topics: Cooling, Data centers, Electronic equipment, Energy dissipation, Energy efficiency, Fans, Heat, Materials properties, Sensors, Steady state
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Paper No: IPACK2011-52166
DOI: https://doi.org/10.1115/IPACK2011-52166
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate

Thong Dang, Carine Serreli, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 451-459, July 6–8, 2011
Paper No: IPACK2011-52067
DOI: https://doi.org/10.1115/IPACK2011-52067
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Topics: Exhaust systems, Flow (Dynamics), Temperature gradient, Temperature, Algorithms, Computational fluid dynamics, Data centers, Engineering simulation, Heat, Simulation
Journal Articles

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
DOI: https://doi.org/10.1115/1.4003603
Published Online: March 9, 2011
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Topics: Data centers, Flow (Dynamics), Pipes, Tiles, Computer simulation, Air flow
Proceedings Papers

Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines

Roger Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 851-862, July 19–23, 2009
Paper No: InterPACK2009-89212
DOI: https://doi.org/10.1115/InterPACK2009-89212
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Topics: Doors, Heat exchangers, Server racks, Water
Proceedings Papers

Minimum Energy Design for Manufacturability of Air Cooled Heat Sinks

Madhusudan Iyengar, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 319-326, July 19–23, 2009
Paper No: InterPACK2009-89093
DOI: https://doi.org/10.1115/InterPACK2009-89093
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Topics: Design for Manufacturing, Heat sinks, Aluminum, Cooling, Copper, Magnesium (Metal), Manufacturing, Computers, Cycles, Design
Proceedings Papers

Co-Generation: Grid Independent Power and Cooling for a Data Center

Roger Schmidt, Madhusudan Iyengar, James Steffes, Vijay Lund
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1063-1075, July 19–23, 2009
Paper No: InterPACK2009-89411
DOI: https://doi.org/10.1115/InterPACK2009-89411
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Topics: Combined heat and power, Cooling, Data centers, Pressure, Reliability
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Paper No: InterPACK2009-89306
DOI: https://doi.org/10.1115/InterPACK2009-89306
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small, Low Power Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1437-1445, November 13–19, 2009
Paper No: IMECE2009-12860
DOI: https://doi.org/10.1115/IMECE2009-12860
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Laminar flow, Cooling, Design, Energy dissipation, Flow (Dynamics), Heat transfer
Journal Articles

Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis

Roger Schmidt, Madhusudan Iyengar, Joe Caricari
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
DOI: https://doi.org/10.1115/1.4001871
Published Online: June 25, 2010
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Topics: Computational fluid dynamics, Data centers, Temperature, Cooling, Air flow
Proceedings Papers

Analytical Modeling of Energy Consumption and Thermal Performance of Data Center Cooling Systems: From the Chip to the Environment

Madhusudan Iyengar, Roger R. Schmidt
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 877-886, July 8–12, 2007
Paper No: IPACK2007-33924
DOI: https://doi.org/10.1115/IPACK2007-33924
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Topics: Cooling systems, Data centers, Energy consumption, Modeling, Temperature, Cooling, Air conditioning, Computers, Energy efficiency, Flow (Dynamics)