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Jae-Min Kim
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Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Proceedings Papers

Micro-LIF Measurement in a Micro-Channel Using an Ultra-Thin Laser Light Sheet

Sang Youl Yoon, Jae Min Kim, Su Hun Kim, Kyun Chun Kim
Proc. ASME. IMECE2004, Fluids Engineering, 349-355, November 13–19, 2004
Paper No: IMECE2004-61020
https://doi.org/10.1115/IMECE2004-61020
View Paper titled, Micro-LIF Measurement in a Micro-Channel Using an Ultra-Thin Laser Light Sheet
Open the PDF for Micro-LIF Measurement in a Micro-Channel Using an Ultra-Thin Laser Light Sheet in another window
Topics: Lasers, Microchannels, Fluorescence, Generators, Signal to noise ratio, Uncertainty