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Proceedings Papers

An Optimization Scheme for Part Quality in Injection Molding

Hua Ye, YingHui Wu, K. K. Wang
Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 139-149, November 16–21, 1997
Paper No: IMECE1997-0625
DOI: https://doi.org/10.1115/IMECE1997-0625
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Topics: Injection molding, Optimization, Simulated annealing, Warping, Computer simulation, Exhaust systems, Optimization algorithms, Tensors
Journal Articles

Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics

Abhi Sirimamilla, Hua Ye, Yinan Wu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021006.
Paper No: EP-17-1114
DOI: https://doi.org/10.1115/1.4042978
Published Online: April 10, 2019
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Topics: Damping, Electronics, Modeling, Simulation, Impact testing
Proceedings Papers

Development of Cryogenic Power Modules for Superconducting Hybrid Power Electronic System

Hua Ye, Pradeep Haldar
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 109-114, October 31–November 6, 2008
Paper No: IMECE2008-69274
DOI: https://doi.org/10.1115/IMECE2008-69274
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Topics: Design, Electronic systems, Hybrid power systems, MOSFET transistors, Nitrogen, Power density, Power systems (Machinery), Weight (Mass)
Proceedings Papers

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Hua Ye, Cemal Basaran, Douglas Hopkins
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 477-483, November 17–22, 2002
Paper No: IMECE2002-33650
DOI: https://doi.org/10.1115/IMECE2002-33650
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Topics: Flip-chip, Flip-chip devices, Solder joints, Electrodiffusion, Temperature, Solders, Anodes, Current density, Damage, Nanoindentation
Journal Articles

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

Hua Ye, Harry Efstathiadis, Pradeep Haldar
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
DOI: https://doi.org/10.1115/1.2229226
Published Online: August 15, 2005
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Topics: Cooling, Heat, MOSFET transistors, Nitrogen, Simulation, Temperature, Critical heat flux, Junctions, Energy dissipation, Boiling