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Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2019-6507

https://doi.org/10.1115/IPACK2019-6507

View Paper titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles

Proceedings Papers

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

Yuvraj Singh, Anirudh Udupa, Srinivasan Chandrasekar, Ganesh Subbarayan

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 7–9, 2019

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2019-6510

https://doi.org/10.1115/IPACK2019-6510

View Paper titled, Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

Topics: Alloys, Lead-free solders, Metal cutting, Cutting, Testing, Cutting tools, Deformation, Dynamometers, Hammers, Microscale devices

Proceedings Papers

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 7–9, 2019

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2019-6501

https://doi.org/10.1115/IPACK2019-6501

View Paper titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Topics: Algorithms, Particulate matter, Packing (Shipments), Packings (Cushioning), Nonlinear programming, Optimization algorithms, Simulation, Computer programming, Gradient methods, Heat

Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

Publisher: ASME

J. Electron. Packag. June 2018, 140(2): 020901.

Paper No: EP-17-1092

https://doi.org/10.1115/1.4039136

Published Online: May 9, 2018

View Article titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties

Proceedings Papers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, August 29–September 1, 2017

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2017-74129

https://doi.org/10.1115/IPACK2017-74129

View Paper titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Topics: Mechanical properties, Network models, Particulate matter, Thermal conductivity, Brittleness, Computer simulation, Elastic moduli, Heat, Heat sinks, Particle size

Proceedings Papers

Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

Yiran Li, Yuvraj Singh, Ganesh Subbarayan

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, August 29–September 1, 2017

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2017-74201

https://doi.org/10.1115/IPACK2017-74201

View Paper titled, Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

Topics: Alloys, Fatigue, Solders, Damage, Tin, Creep, Constitutive equations, Energy dissipation, Entropy, Fatigue damage

Proceedings Papers

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Sai Sudharsanan Paranjothy, Ganesh Subbarayan, Dae Young Jung, Bahgat G. Sammakia

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A009, July 6–9, 2015

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2015-48653

https://doi.org/10.1115/IPACK2015-48653

View Paper titled, An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Topics: Constitutive equations, Copper, Displacement, Finite element analysis, Fracture (Materials), Fracture (Process), Bonding, Electrical properties, High temperature, Modeling

Proceedings Papers

Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs

Anirudh Udupa, Ganesh Subbarayan, Cheng-Kok Koh

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2015-48656

https://doi.org/10.1115/IPACK2015-48656

View Paper titled, Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs

Topics: Risk, Shear stress, Stress, Reliability, Copper, Delamination, Silicon, Stress singularity

Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2015-48655

https://doi.org/10.1115/IPACK2015-48655

View Paper titled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders

Proceedings Papers

Simulations of Deformation and Stress During Copper Wirebond on ULK Chips

Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A012, July 16–18, 2013

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2013-73178

https://doi.org/10.1115/IPACK2013-73178

View Paper titled, Simulations of Deformation and Stress During Copper Wirebond on ULK Chips

Topics: Copper, Deformation, Engineering simulation, Simulation, Stress, Fracture (Materials), Vibration, Critical points (Physics), Wire, Wire bonding

Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso

Publisher: ASME

J. Electron. Packag. June 2012, 134(2): 020907.

https://doi.org/10.1115/1.4006707

Published Online: June 11, 2012

View Article titled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy

Proceedings Papers

Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials

Nikhil Bajaj, Ganesh Subbarayan, Suresh V. Garimella

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 427-436, November 12–18, 2010

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2010-40953

https://doi.org/10.1115/IMECE2010-40953

View Paper titled, Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials

Topics: Design, Flow (Dynamics), Optimization, Approximation, Finite element methods, Design sensitivity analysis, Electronic systems, Microchannels, Sensitivity analysis, Thermal conductivity

Proceedings Papers

Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 585-590, July 6–8, 2011

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2011-52230

https://doi.org/10.1115/IPACK2011-52230

View Paper titled, Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

Topics: Computer simulation, Electrodiffusion, Lead-free solders, Stress, Finite element analysis, Flip-chip, Solder joints, Accounting, Diffusion (Physics), Electric potential

Proceedings Papers

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2011-52237

https://doi.org/10.1115/IPACK2011-52237

View Paper titled, Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Topics: Dielectric materials, Fracture (Materials), Modeling, Failure, Fracture (Process), Fracture toughness, Boundary-value problems, Computer-aided design, Crack propagation, Displacement

Proceedings Papers

Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts

Simranjit Khalsa, Ganesh Subbarayan

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2011-52170

https://doi.org/10.1115/IPACK2011-52170

View Paper titled, Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts

Topics: Flow (Dynamics), Plates (structures), Fluids, Particulate matter, Finite element analysis, Flat heat pipes, Pressure, Viscosity, Yield strength

Proceedings Papers

Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

Hung-Yun Lin, Abhishek Tambat, Ian Claydon, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia

Publisher: American Society of Mechanical Engineers

Paper No: IPACK2011-52258

https://doi.org/10.1115/IPACK2011-52258

View Paper titled, Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

Topics: Deformation, Fracture (Process), Risk, Temperature, Computer software, Cooling, Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages

Journal citation

NARROW

A Noncontact Method for Estimating Thin Metal Film Adhesion Strength Through Current-Induced Void Growth

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Simulations of Deformation and Stress During Copper Wirebond on ULK Chips

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Topological Design Optimization of Nested Channels for Squeeze Flow of Thermal Interface Materials

Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Squeeze Flow Models for Thermal Interface Materials Contained Between Parallel Plates and Plates With Posts

Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

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