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Edward S. Piekos
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Proceedings Papers

The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance

Ramez Cheaito, John C. Duda, Thomas E. Beechem, Jon F. Ihlefeld, Khalid Hattar, Edward S. Piekos, Amit Misra, Jon K. Baldwin, Patrick E. Hopkins
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A009, July 14–19, 2013
Paper No: HT2013-17541
https://doi.org/10.1115/HT2013-17541
View Paper titled, The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance
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Topics: Copper, Electrical conductance, Electron transport, Electromagnetic scattering, Electrons, Metals, Thermal conductivity, Resistors, Temperature, Thermoreflectance
Proceedings Papers

Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures

Justin R. Serrano, Edward S. Piekos, Leslie M. Phinney
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 525-531, July 8–12, 2012
Paper No: HT2012-58114
https://doi.org/10.1115/HT2012-58114
View Paper titled, Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures
Open the PDF for Raman Thermometry and Thermal Modeling of Highly Doped Silicon-on-Insulator Joule Heated MEMS Bridges Under Varying Gas Pressures in another window
Topics: Bridges (Structures), Joules, Microelectromechanical systems, Modeling, Silicon-on-insulator, Temperature measurement, Temperature, Simulation, Heat transfer, Pressure
Journal Articles

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr

Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. July 2010, 132(7): 072402.
https://doi.org/10.1115/1.4000965
Published Online: April 28, 2010
View Article titled, Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 Torr to 625 Torr
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Topics: Bridges (Structures), Finite element analysis, Heat transfer, Microelectromechanical systems, Pressure, Simulation, Temperature, Temperature measurement, Heat conduction, Temperature profiles
Proceedings Papers

Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 to 625 Torr

Leslie M. Phinney, Justin R. Serrano, Edward S. Piekos, John R. Torczynski, Michael A. Gallis, Allen D. Gorby
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 389-398, July 19–23, 2009
Paper No: HT2009-88583
https://doi.org/10.1115/HT2009-88583
View Paper titled, Raman Thermometry Measurements and Thermal Simulations for MEMS Bridges at Pressures From 0.05 to 625 Torr
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Topics: Bridges (Structures), Engineering simulation, Microelectromechanical systems, Simulation, Temperature measurement, Pressure, Finite element analysis, Finite element model, Heat transfer, Materials properties
Proceedings Papers

Bond Pad Effects on Steady State Thermal Conductivity Measurement Using Suspended Micromachined Test Structures

Leslie M. Phinney, Edward S. Piekos, Jaron D. Kuppers
Proc. ASME. IMECE2007, Volume 11: Micro and Nano Systems, Parts A and B, 561-568, November 11–15, 2007
Paper No: IMECE2007-41349
https://doi.org/10.1115/IMECE2007-41349
View Paper titled, Bond Pad Effects on Steady State Thermal Conductivity Measurement Using Suspended Micromachined Test Structures
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Topics: Micromachining, Steady state, Thermal conductivity measurement, Heating, Joules, Temperature, Boundary-value problems, Bridges (Structures), Electrical resistance, Engineering simulation