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Proceedings Papers

Single Phase Immersion Cooling for Hyper Scale Data Centers: Challenges and Opportunities

Dereje Agonafer, Pratik Bansode, Satyam Saini, Jessica Gullbrand, Ashish Gupta
Publisher: American Society of Mechanical Engineers
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T16A008, July 10–12, 2023
Paper No: HT2023-107598
https://doi.org/10.1115/HT2023-107598
View Paper titled, Single Phase Immersion Cooling for Hyper Scale Data Centers: Challenges and Opportunities
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Topics: Cooling, Data centers
Proceedings Papers

The LVEL Turbulence Model for Conjugate Heat Transfer at Low Reynolds Numbers

Dereje Agonafer, Liao Gan-Li, D. Brian Spalding
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 23-26, November 17–22, 1996
Paper No: IMECE1996-0998
https://doi.org/10.1115/IMECE1996-0998
View Paper titled, The LVEL Turbulence Model for Conjugate Heat Transfer at Low Reynolds Numbers
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Topics: Heat transfer, Reynolds number, Turbulence, Computer cooling, Geometry
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Paper No: IPACK2022-97443
https://doi.org/10.1115/IPACK2022-97443
View Paper titled, Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level
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Topics: Computational fluid dynamics, Cooling, Transient analysis, Transients (Dynamics)
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Paper No: IPACK2022-97402
https://doi.org/10.1115/IPACK2022-97402
View Paper titled, CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Paper No: IPACK2022-97481
https://doi.org/10.1115/IPACK2022-97481
View Paper titled, Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A007, October 25–27, 2022
Paper No: IPACK2022-97423
https://doi.org/10.1115/IPACK2022-97423
View Paper titled, Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate
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Topics: Cooling, Thermomechanics
Proceedings Papers

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Paper No: IPACK2022-97425
https://doi.org/10.1115/IPACK2022-97425
View Paper titled, Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment
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Topics: Cooling, Data centers, Flow control, Plates (structures), Transients (Dynamics)
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Paper No: IPACK2022-97494
https://doi.org/10.1115/IPACK2022-97494
View Paper titled, Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Paper No: IPACK2022-97445
https://doi.org/10.1115/IPACK2022-97445
View Paper titled, CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server
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Topics: Computational fluid dynamics, Cooling, Heat
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Proceedings Papers

Heat Transfer Education: Keeping it Relevant and Vibrant

Ali M. Khounsary, James R. Mondt, Terry Simon, Dereje Agonafer, David P. DeWitt, Richard S. Figliola, William L. Grosshandler, Frank Kreith
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 17-23, November 15–20, 1998
Paper No: IMECE1998-0632
https://doi.org/10.1115/IMECE1998-0632
View Paper titled, Heat Transfer Education: Keeping it Relevant and Vibrant
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Topics: Education, Heat transfer, Students, Engineering teachers, Engineers, Thermal management, Collaboration, Feedback, Governments, Mechanical engineering
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Article titled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041008.
Paper No: EP-21-1115
https://doi.org/10.1115/1.4052324
Published Online: November 22, 2021
View Article titled, Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop
Proceedings Papers

Cooling of a PWB With Irregular Populated Chips

Yiwu Ding, Dereje Agonafer, Elliott Short
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 293-298, November 5–10, 2000
Paper No: IMECE2000-2276
https://doi.org/10.1115/IMECE2000-2276
View Paper titled, Cooling of a PWB With Irregular Populated Chips
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Topics: Cooling, Printed circuit boards, Temperature, Computational fluid dynamics, Buoyancy, Flat heat pipes, Simulation, Thermal conductivity, Heat conduction, Heat sinks
Proceedings Papers

Mathematical Model for Thermostatic Expansion Valve

Yiwu Ding, Dereje Agonafer, Roger Schmidt
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 285-292, November 5–10, 2000
Paper No: IMECE2000-2275
https://doi.org/10.1115/IMECE2000-2275
View Paper titled, Mathematical Model for Thermostatic Expansion Valve
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Topics: Thermostatics, Valves, Cooling, Electronics, Evaporation, Refrigeration, Steady state, Temperature
Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables