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1-5 of 5
Debbie G. Senesky
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Proceedings Papers
Proc. ASME. IDETC-CIE2022, Volume 3B: 48th Design Automation Conference (DAC), V03BT03A028, August 14–17, 2022
Paper No: DETC2022-91196
Journal Articles
Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021115.
Paper No: EP-21-1064
Published Online: March 7, 2022
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020
Paper No: IPACK2020-2589
Proceedings Papers
Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015
Paper No: IPACK2015-48409
Proceedings Papers
Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 965-972, August 7–10, 2011
Paper No: ES2011-54699