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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022

Paper No: IPACK2022-96635

DOI: https://doi.org/10.1115/IPACK2022-96635

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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids

Proceedings Papers

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Joshua Kasitz, Larry Marshall, Jr., David Huitink

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022

Paper No: IPACK2022-97399

DOI: https://doi.org/10.1115/IPACK2022-97399

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Topics: Cooling, Heat transfer, Nanoparticles, Phase change materials, Thermal conductivity

Proceedings Papers

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022

Paper No: IPACK2022-97446

DOI: https://doi.org/10.1115/IPACK2022-97446

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Topics: Additive manufacturing, Computer simulation, Cooling, Geometry, Heat, Heat sinks, Heat transfer, Manifolds, Nozzles

Proceedings Papers

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022

Paper No: IPACK2022-97412

DOI: https://doi.org/10.1115/IPACK2022-97412

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Topics: Chemical vapor deposition, Coatings, Cooling, Density, Electrodes, Electronics, Fluids, Ionization, Thermal resistance

Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao

J. Electron. Packag. March 2023, 145(1): 011106.

Paper No: EP-22-1021

DOI: https://doi.org/10.1115/1.4056030

Published Online: November 23, 2022

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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating

Includes: Supplementary data

Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic

J. Electron. Packag. March 2023, 145(1): 011105.

Paper No: EP-22-1022

DOI: https://doi.org/10.1115/1.4056031

Published Online: November 11, 2022

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Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling

Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink

J. Electron. Packag. March 2023, 145(1): 011101.

Paper No: EP-22-1023

DOI: https://doi.org/10.1115/1.4055464

Published Online: September 27, 2022

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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors

Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo

J. Electron. Packag. June 2022, 144(2): 021115.

Paper No: EP-21-1064

DOI: https://doi.org/10.1115/1.4053765

Published Online: March 7, 2022

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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability

Journal Articles

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, Asif Imran, Sarah Myane, Noah Akey, Fang Luo, David Huitink

J. Electron. Packag. June 2022, 144(2): 024502.

Paper No: EP-21-1049

DOI: https://doi.org/10.1115/1.4053642

Published Online: February 16, 2022

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Topics: Electromagnetic interference, Electronics, Nanocomposites, Silicones, Nanoparticles, Iron

Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021

Paper No: IPACK2021-73313

DOI: https://doi.org/10.1115/IPACK2021-73313

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Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat

Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021

Paper No: IPACK2021-73252

DOI: https://doi.org/10.1115/IPACK2021-73252

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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux

Proceedings Papers

Characterization of High-Density Aircraft Electronic and Thermal Management Systems

Joshua Kasitz, David Huitink

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 26–28, 2021

Paper No: IPACK2021-73287

DOI: https://doi.org/10.1115/IPACK2021-73287

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Topics: Aircraft, Aviation, Density, Reliability, Thermal management

Proceedings Papers

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021

Paper No: IPACK2021-69511

DOI: https://doi.org/10.1115/IPACK2021-69511

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Topics: Aluminum, Cooling, Cycles, Electronics, Energy dissipation, Heating, Junctions, Life testing, Maintenance, Random vibration

Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021

Paper No: IPACK2021-72726

DOI: https://doi.org/10.1115/IPACK2021-72726

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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization

Journal Articles

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

J. Electron. Packag. June 2022, 144(2): 021107.

Paper No: EP-21-1056

DOI: https://doi.org/10.1115/1.4052408

Published Online: October 6, 2021

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Topics: Capacitance, Coolants, Gates (Closures), MOSFET transistors, Reliability, Temperature, Traction, Roads, Thermal resistance

Proceedings Papers

Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

Hayden Carlton, Ange Iradukunda, David Huitink, Sarah Myane, Noah Akey, Asif Imran, Fang Luo

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 27–29, 2020

Paper No: IPACK2020-2576

DOI: https://doi.org/10.1115/IPACK2020-2576

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Topics: Electronics, Nanocomposites

Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020

Paper No: IPACK2020-2581

DOI: https://doi.org/10.1115/IPACK2020-2581

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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles

Proceedings Papers

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020

Paper No: IPACK2020-2589

DOI: https://doi.org/10.1115/IPACK2020-2589

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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Magnetic fields, Reliability, Sensors

Proceedings Papers

Additive Fabricated Compliant Interconnects: Design, Fabrication and Reliability Effects

Tumininu Olatunji, David Huitink

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020

Paper No: IPACK2020-2596

DOI: https://doi.org/10.1115/IPACK2020-2596

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Topics: Additive manufacturing, Design, Electronic packaging, Manufacturing, Reliability, Solder joints

Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo

J. Electron. Packag. December 2020, 142(4): 041004.

Paper No: EP-20-1034

DOI: https://doi.org/10.1115/1.4048493

Published Online: October 12, 2020

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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer

Journal citation

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Supplemental Material

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Module-Level Thermal Interface Material Degradation in HALT

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Transient Performance and Melt Front Characterization of Phase Change Materials

Characterization of High-Density Aircraft Electronic and Thermal Management Systems

Module-Level TIM Degradation in HALT

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Multifunctional Magnetic Nanocomposite Encapsulant for EMI Shielding in Power Electronics

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Additive Fabricated Compliant Interconnects: Design, Fabrication and Reliability Effects

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

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