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Proceedings Papers

MEMS Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips

S. C. Yao, C. H. Amon, K. Gabriel, P. Kumta, J. Y. Murthy, C. F. Wu, C. C. Hsieh, D. Boyalakuntla, S. V. J. Narumanchi, K. Rebello

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 181-192, November 11–16, 2001

Paper No: IMECE2001/HTD-24392

DOI: https://doi.org/10.1115/IMECE2001/HTD-24392

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Topics: Cooling systems, Microelectromechanical systems, Sprays, Cooling, Fluids, Drops, Nozzles, Flux (Metallurgy), Heat, Silicon

Proceedings Papers

Assessment of Fourier-Based Thermal Models Used in Frequency-Domain Thermoreflectance Data Analysis

D. P. Sellan, V. Mishra, J. A. Malen, A. J. H. McGaughey, C. H. Amon

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 683-686, March 3–6, 2012

Paper No: MNHMT2012-75087

DOI: https://doi.org/10.1115/MNHMT2012-75087

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Topics: Thermoreflectance, Phonons, Heat conduction, Relaxation (Physics), Temperature, Temperature profiles

Proceedings Papers

Predicting the Phonon Properties of Carbon Nanotubes Using the Spectra Energy Density

J. A. Thomas, J. E. Turney, R. M. Iutzi, A. J. H. McGaughey, C. H. Amon

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 305-312, August 8–13, 2010

Paper No: IHTC14-22262

DOI: https://doi.org/10.1115/IHTC14-22262

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Topics: Carbon nanotubes, Density, Phonons, Spectra (Spectroscopy), Simulation, Water, Atoms, Composite materials, Molecular dynamics, Molecular dynamics simulation

Proceedings Papers

Increasing Efficiencies of Thermoelectric Devices Through Angular Interface Geometries

D. P. Sellan, C. H. Amon

Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 1, 781-789, July 19–23, 2009

Paper No: ES2009-90058

DOI: https://doi.org/10.1115/ES2009-90058

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Topics: Acoustics, Germanium, Phonons, Silicon, Simulation results, Thermal conductivity, Thermoelectric devices, Thin films

Proceedings Papers

Critically Assessing the Application of Quantum Corrections to Classical Thermal Conductivity Predictions

J. E. Turney, A. J. H. McGaughey, C. H. Amon

Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 139-143, July 19–23, 2009

Paper No: HT2009-88129

DOI: https://doi.org/10.1115/HT2009-88129

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Topics: Thermal conductivity, Flux (Metallurgy), Lattice dynamics, Molecular dynamics, Silicon, Simulation, Temperature

Proceedings Papers

Thin Film Thermal Conductivity by Anharmonic Lattice Dynamics Calculations

J. E. Turney, A. J. H. McGaughey, C. H. Amon

Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 1195-1197, October 31–November 6, 2008

Paper No: IMECE2008-66697

DOI: https://doi.org/10.1115/IMECE2008-66697

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Topics: Lattice dynamics, Thermal conductivity, Thin films, Phonons, Crystals, Film thickness, Mode shapes, Molecular dynamics simulation

Proceedings Papers

Effects of Confinement and Surface Reconstruction on the Lattice Dynamics and Thermal Transport Properties of Thin Films

Joseph E. Turney, A. J. H. McGaughey, C. H. Amon

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 789-797, July 8–12, 2007

Paper No: HT2007-32274

DOI: https://doi.org/10.1115/HT2007-32274

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Topics: Lattice dynamics, Thin films, Phonons, Silicon, Density, Film thickness, Temperature

Proceedings Papers

Argon Thermal Conductivity by Anharmonic Lattice Dynamics Calculations

J. E. Turney, A. J. H. McGaughey, C. H. Amon

Proc. ASME. HT2008, Heat Transfer: Volume 1, 345-347, August 10–14, 2008

Paper No: HT2008-56146

DOI: https://doi.org/10.1115/HT2008-56146

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Topics: Lattice dynamics, Thermal conductivity, Phonons, Temperature, Crystals, Low temperature, Melting point, Mode shapes, Molecular dynamics simulation

Proceedings Papers

Design of Direct Methanol Micro Fuel Cell Fluidic Systems

S. C. Yao, G. K. Fedder, C. H. Amon, C. C. Hsieh, X. Tang, Y. Alyousef

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 431-436, November 17–22, 2002

Paper No: IMECE2002-32567

DOI: https://doi.org/10.1115/IMECE2002-32567

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Topics: Design, Methanol, Micro fuel cells, Bubbles, Carbon dioxide, Flow (Dynamics), Fluid handling, Manufacturing, Microelectromechanical systems, Microfluidics

Journal Articles

The Effect of Asymmetry in Abdominal Aortic Aneurysms Under Physiologically Realistic Pulsatile Flow Conditions

E. A. Finol, ASME Member, Research Assistant Professor,, K. Keyhani, Staff Engineer,, C. H. Amon, ASME Life Fellow, Raymond J. Lane Distinguished Professor,

J Biomech Eng. April 2003, 125(2): 207–217.

DOI: https://doi.org/10.1115/1.1543991

Published Online: April 9, 2003

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Topics: Aneurysms, Flow (Dynamics), Hemodynamics, Pressure, Pulsatile flow, Shear stress, Vortices, Stress, Aorta, Reynolds number

Journal Articles

Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 2: Thermomechanical Models of Adjacent Droplets

R. K. Chin, Graduate Student, J. L. Beuth, Associate Professor, Mem. ASME, C. H. Amon, Professor, Fellow ASME

J. Manuf. Sci. Eng. November 2001, 123(4): 632–638.

DOI: https://doi.org/10.1115/1.1380200

Published Online: May 1, 2000

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Topics: Drops, Stress

Journal Articles

Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 1: Thermomechanical Models of Layers and Droplet Columns

R. K. Chin, Graduate Student, J. L. Beuth, Associate Professor, Mem. ASME, C. H. Amon, Professor, Fellow ASME

J. Manuf. Sci. Eng. November 2001, 123(4): 623–631.

DOI: https://doi.org/10.1115/1.1380199

Published Online: May 1, 2000

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Topics: Drops, Stress, Temperature, Thermomechanics, Simulation, Metals, Engineering simulation

Journal Articles

Shape Deposition Manufacturing With Microcasting: Processing, Thermal and Mechanical Issues

C. H. Amon, J. L. Beuth, L. E. Weiss, R. Merz, F. B. Prinz

J. Manuf. Sci. Eng. August 1998, 120(3): 656–665.

DOI: https://doi.org/10.1115/1.2830171

Published Online: August 1, 1998

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Topics: Manufacturing, Shapes, Metals, Bonding, Drops, Stress, Computer numerical control machine tools, Cooling, Machining, Modeling

Journal Articles

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

M. I. Campbell, C. H. Amon, J. Cagan

J. Electron. Packag. June 1997, 119(2): 106–113.

DOI: https://doi.org/10.1115/1.2792210

Published Online: June 1, 1997

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Topics: Electronic components, Heat, Algorithms, Simulated annealing, Computers, Heat transfer, Temperature

Journal Articles

Oscillatory Momentum Transport Mechanisms in Transitional Complex Geometry Flows

D. Majumdar, C. H. Amon

J. Fluids Eng. March 1997, 119(1): 29–35.

DOI: https://doi.org/10.1115/1.2819114

Published Online: March 1, 1997

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Topics: Flow (Dynamics), Geometry, Momentum, Shear stress, Computer simulation, Energy dissipation, Energy transformation, Kinetic energy, Pressure, Reynolds number

Journal Articles

Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

C. H. Amon, K. S. Schmaltz, R. Merz, F. B. Prinz

J. Heat Transfer. February 1996, 118(1): 164–172.

DOI: https://doi.org/10.1115/1.2824030

Published Online: February 1, 1996

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Topics: Bonding, Drops, Manufacturing, Metals, Computer simulation, Temperature, Cooling, Heat transfer, Solidification, Analytical methods

Journal Articles

Time-Dependent Conjugate Heat Transfer Characteristics of Self-Sustained Oscillatory Flows in a Grooved Channel

J. S. Nigen, C. H. Amon

J. Fluids Eng. September 1994, 116(3): 499–507.

DOI: https://doi.org/10.1115/1.2910305

Published Online: September 1, 1994

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Topics: Flow (Dynamics), Heat transfer, Heat, Convection, Cooling, Design, Heat conduction, Heat exchangers, Heat flux, Reynolds number

Journal Articles

Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows

J. S. Nigen, C. H. Amon

J. Electron. Packag. December 1993, 115(4): 356–365.

DOI: https://doi.org/10.1115/1.2909344

Published Online: December 1, 1993

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Topics: Cooling, Electronic packages, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Bifurcation, Computer simulation, Design, Heat, Poiseuille flow

Journal Articles

Heat and Momentum Transport in Self-Sustained Oscillatory Viscous Flows

D. Majumdar, C. H. Amon

J. Heat Transfer. November 1992, 114(4): 866–873.

DOI: https://doi.org/10.1115/1.2911894

Published Online: November 1, 1992

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Topics: Flow (Dynamics), Heat, Heat transfer, Momentum, Reynolds number, Computer simulation, Convection, Fluctuations (Physics), Forced convection, Oscillations

Journal Articles

Heat Transfer Enhancement by Flow Destabilization in Electronic Chip Configurations

C. H. Amon

J. Electron. Packag. March 1992, 114(1): 35–40.

DOI: https://doi.org/10.1115/1.2905439

Published Online: March 1, 1992

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Topics: Flow (Dynamics), Heat transfer, Computer simulation, Convection, Cooling systems, Design, Energy dissipation, Oscillations, Reynolds number, Traveling waves

Journal citation

NARROW

MEMS Enabled Micro Spray Cooling System for Thermal Control of Electronic Chips

Assessment of Fourier-Based Thermal Models Used in Frequency-Domain Thermoreflectance Data Analysis

Predicting the Phonon Properties of Carbon Nanotubes Using the Spectra Energy Density

Increasing Efficiencies of Thermoelectric Devices Through Angular Interface Geometries

Critically Assessing the Application of Quantum Corrections to Classical Thermal Conductivity Predictions

Thin Film Thermal Conductivity by Anharmonic Lattice Dynamics Calculations

Effects of Confinement and Surface Reconstruction on the Lattice Dynamics and Thermal Transport Properties of Thin Films

Argon Thermal Conductivity by Anharmonic Lattice Dynamics Calculations

Design of Direct Methanol Micro Fuel Cell Fluidic Systems

The Effect of Asymmetry in Abdominal Aortic Aneurysms Under Physiologically Realistic Pulsatile Flow Conditions

Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 2: Thermomechanical Models of Adjacent Droplets

Successive Deposition of Metals in Solid Freeform Fabrication Processes, Part 1: Thermomechanical Models of Layers and Droplet Columns

Shape Deposition Manufacturing With Microcasting: Processing, Thermal and Mechanical Issues

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

Oscillatory Momentum Transport Mechanisms in Transitional Complex Geometry Flows

Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

Time-Dependent Conjugate Heat Transfer Characteristics of Self-Sustained Oscillatory Flows in a Grooved Channel

Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows

Heat and Momentum Transport in Self-Sustained Oscillatory Viscous Flows

Heat Transfer Enhancement by Flow Destabilization in Electronic Chip Configurations

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