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Arman Nokhosteen
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Proceedings Papers

Performance Evaluation of a Solar Thermal Collector With Custom-Made Reflector: An Experimental Study in Midwest Region

Arman Nokhosteen, Onur Ozkaya, Sarvenaz Sobhansarbandi
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A059, October 30–November 3, 2022
Paper No: IMECE2022-96304
DOI: https://doi.org/10.1115/IMECE2022-96304
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Topics: Design, Performance evaluation, Solar collectors, Solar energy, Solar water heating, Latent heat, Significant wave heights, Temperature, Cold climates, Electromagnetic scattering
Proceedings Papers

A Novel Computationally Efficient Numerical Model for Thermal Behavior Prediction of an Evacuated Tube Solar Collector Incorporated With Phase Change Materials: A Preliminary Analysis

Arman Nokhosteen, Sarvenaz Sobhansarbandi
Proc. ASME. POWER2022, ASME 2022 Power Conference, V001T15A006, July 18–19, 2022
Paper No: POWER2022-86324
DOI: https://doi.org/10.1115/POWER2022-86324
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Topics: Computer simulation, Lattice Boltzmann methods, Phase change materials, Solar collectors
Proceedings Papers

An Innovative Thermal Analysis Model for Continuous Operation of a Solar Collector

Arman Nokhosteen, Sarvenaz Sobhansarbandi
Proc. ASME. IMECE2020, Volume 8: Energy, V008T08A059, November 16–19, 2020
Paper No: IMECE2020-23954
DOI: https://doi.org/10.1115/IMECE2020-23954
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Topics: Lattice Boltzmann methods, Numerical analysis, Solar collectors, Thermal analysis
Proceedings Papers

Thermal Performance Evaluation of a Solar Collector Utilizing a Novel Resistance Network Model

Arman Nokhosteen, Sarvenaz Sobhansarbandi
Proc. ASME. POWER2020, ASME 2020 Power Conference, V001T08A013, August 4–5, 2020
Paper No: POWER2020-16579
DOI: https://doi.org/10.1115/POWER2020-16579
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Topics: Network models, Performance evaluation, Principal component analysis, Solar collectors
Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
DOI: https://doi.org/10.1115/1.4041666
Published Online: February 25, 2019
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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles