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Andrzej Mościcki
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Proceedings Papers

Reliability of Interconnections Made of Sintered Silver Nano Particles

Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A016, July 6–9, 2015
Paper No: IPACK2015-48795
DOI: https://doi.org/10.1115/IPACK2015-48795
View Paper titled, Reliability of Interconnections Made of Sintered Silver Nano Particles
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Topics: Nanoparticles, Reliability, Silver, Sensors, Algorithms, Chain, Coating processes, Coatings, Computerized tomography, Failure mechanisms
Proceedings Papers

The Efficiency of Heat Transfer Through the Interface of Sintered Silver Nanoparticles

Tomasz Fałat, Przemysław Matkowski, Krzysztof Stojek, Jan Felba, Bartosz Płatek, Andrzej Mościcki
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A077, July 6–9, 2015
Paper No: IPACK2015-48732
DOI: https://doi.org/10.1115/IPACK2015-48732
View Paper titled, The Efficiency of Heat Transfer Through the Interface of Sintered Silver Nanoparticles
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Topics: Heat transfer, Nanoparticles, Silver, Temperature, Junctions, Transistors, Copper, Heat conduction, Inspection, Structural analysis
Journal Articles

Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

Andrzej Mościcki, Jan Felba, Tadeusz Sobierajski, Józef Kudzia
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 91–95.
DOI: https://doi.org/10.1115/1.1899165
Published Online: November 25, 2004
View Article titled, Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications
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Topics: Adhesives, Hardening (Curing), Fillers (Materials)