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Journal Articles

Aerosol Jet and Inkjet Printing Methods for Die-Level Packaging of Custom MEMS Devices

Andriy Sherehiy, Douglas Jackson, Michael Sassa, Daniel Sills, Dilan Ratnayake, Ruoshi Zhang, Zhong Yang, Kevin Walsh, John Naber, Dan O. Popa
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Micro Nano Sci. Eng. March 2025, 13(1): 011003.
Paper No: JMNM-24-1025
https://doi.org/10.1115/1.4066944
Published Online: November 21, 2024
View Article titled, Aerosol Jet and Inkjet Printing Methods for Die-Level Packaging of Custom MEMS Devices
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Topics: Aerosols, Electrodes, Microelectromechanical systems, Microrobots, Packaging, Printing, Ultraviolet cured adhesives, Manufacturing