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Keywords: interconnections
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Journal Articles
Publisher: ASME
Article Type: Design Of Medical Devices Conference Abstracts
J. Med. Devices. June 2010, 4(2): 027513.
Published Online: August 9, 2010
... to the final packaging of the devices. It is considered expensive compared with device fabrication in certain applications. Majority of MEMS devices are still housing traditional packaging methods due to difficulty in handling and yield loss. The advanced interconnect solutions based on thin silicon carrier...