...Kuan Lu; Zhikun Wang; Heebum Chun; ChaBum Lee This paper introduces a novel wafer-edge quality inspection method based on analysis of curved-edge diffractive fringe patterns, which occur when light is incident and diffracts around the wafer edge. The proposed method aims to identify various defect...

... and distortion. In this paper, studies of the characteristics of diamond machined surface and scattering from the diamond machined surfaces are presented. Four different parameters, the first order optical diffraction, the zero order reflection, the surface roughness, and the residual tool mark depth, are used...