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Journal Articles

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Kuan Lu, Zhikun Wang, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070908.
Paper No: MANU-23-1366
https://doi.org/10.1115/1.4065639
Published Online: June 10, 2024
View Article titled, Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis
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Topics: Diffraction patterns, Imaging, Inspection, Metrology, Semiconductor wafers, Feature extraction, Particulate matter
Journal Articles

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Fengfeng Zhou, Xingyu Fu, Siying Chen, Changheon Han, Martin B. G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070907.
Paper No: MANU-23-1611
https://doi.org/10.1115/1.4065523
Published Online: June 3, 2024
View Article titled, Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies
Open the PDF for Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies in another window
Topics: Fibers, Flaw detection, Interferometers, Semiconductor wafers, Leakage, Optical fiber, Refractive index, Wavelength
Journal Articles

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070906.
Paper No: MANU-23-1591
https://doi.org/10.1115/1.4065276
Published Online: May 9, 2024
View Article titled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
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Topics: Resolution (Optics), Semiconductor wafers, Inspection
Journal Articles

Hole Edge Metrology and Inspection by Edge Diffractometry

Kuan Lu, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070905.
Paper No: MANU-24-1019
https://doi.org/10.1115/1.4065314
Published Online: April 29, 2024
View Article titled, Hole Edge Metrology and Inspection by Edge Diffractometry
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Topics: Diffraction, Diffraction patterns, Inspection, Metrology, Surface roughness, Geometry
Journal Articles

Measurement of Thermal Field Temperature Distribution Inside Reaction Chamber for Epitaxial Growth of Silicon Carbide Layer

Shiwei Deng, Yancheng Wang, Jiafeng Cheng, Wenjie Shen, Deqing Mei
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070901.
Paper No: MANU-23-1294
https://doi.org/10.1115/1.4065021
Published Online: April 22, 2024
View Article titled, Measurement of Thermal Field Temperature Distribution Inside Reaction Chamber for Epitaxial Growth of Silicon Carbide Layer
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Topics: Gas flow, Silicon carbide, Temperature, Temperature distribution, Flow (Dynamics), High temperature
Journal Articles

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Shu-Kai S. Fan, Pei-Chen Chen, Chih-Hung Jen, Kanchana Sethanan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070904.
Paper No: MANU-23-1598
https://doi.org/10.1115/1.4065118
Published Online: April 22, 2024
View Article titled, Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing
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Topics: Semiconductor wafers, Integrated circuit fabrication
Journal Articles

Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

Hyuck Lee, Hyeonwoo Kim, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070902.
Paper No: MANU-23-1590
https://doi.org/10.1115/1.4065226
Published Online: April 22, 2024
View Article titled, Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels
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Topics: Cams, Image segmentation, Semantics, Semiconductor wafers, Trains
Journal Articles

Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning

Hyeonwoo Kim, Heegeon Yoon, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070903.
Paper No: MANU-23-1525
https://doi.org/10.1115/1.4065255
Published Online: April 22, 2024
View Article titled, Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning
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Topics: Semiconductor wafers, Trains, Feature extraction, Algorithms, Ablation (Vaporization technology)