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Journal Articles

Optical Metrology of Critical Dimensions in Large-Area Nanostructure Arrays With Complex Patterns

Ramin Sabbagh, Alec Stothert, S. V. Sreenivasan, Dragan Djurdjanovic

J. Manuf. Sci. Eng. June 2023, 145(6): 061010.

Paper No: MANU-22-1619

DOI: https://doi.org/10.1115/1.4056923

Published Online: March 14, 2023

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Topics: Dimensions, Gages, Inspection, Inverse problems, Metrology, Reflectance, Semiconductor wafers, Spectra (Spectroscopy), Optimization, Simulation

Journal Articles

Face Turning of Single Crystal (111)Ge: Cutting Mechanics and Surface/Subsurface Characteristics

Arezoo Zare, Michele Tunesi, Tres A. Harriman, John R. Troutman, Matthew A. Davies, Don A. Lucca

J. Manuf. Sci. Eng.

Paper No: MANU-22-1625

DOI: https://doi.org/10.1115/1.4057054

Published Online: March 7, 2023

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Topics: Crystals, Cutting, Machining, Turning, Anisotropy, Atomic force microscopy, Brittle fracture, Corners (Structural elements), Diamond turning, Elastic moduli

Journal Articles

Precision Silicon Exfoliation Tool Design

Martin J. Ward, Dipankar Behera, Michael A. Cullinan

J. Manuf. Sci. Eng. February 2023, 145(2): 024501.

Paper No: MANU-22-1105

DOI: https://doi.org/10.1115/1.4055320

Published Online: September 27, 2022

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Topics: Design, Metrology, Semiconductor wafers, Silicon, Stress, Surface roughness, Errors, Nickel, Film thickness, Engineering prototypes

Journal Articles

Study on Controllable Thickness and Flatness of Wafer-Scale Nickel Shim in Precision Electroforming Process: Simulation and Validation

Honggang Zhang, Nan Zhang, Fengzhou Fang

J. Manuf. Sci. Eng. November 2021, 143(11): 111005.

Paper No: MANU-20-1688

DOI: https://doi.org/10.1115/1.4051006

Published Online: June 11, 2021

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Topics: Current density, Electroforming, Nickel, Semiconductor wafers, Electrodeposition

Journal Articles

Influence of Precursor Concentration on Crystalline Quality of GaN Thin Films Grown on a Sapphire Wafer

Omar Dhannoon Jumaah, Yogesh Jaluria

J. Manuf. Sci. Eng. November 2021, 143(11): 111001.

Paper No: MANU-21-1071

DOI: https://doi.org/10.1115/1.4050825

Published Online: May 7, 2021

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Topics: Gallium nitride, Thin films, Semiconductor wafers, Sapphire, Metalorganic chemical vapor deposition, Atomic force microscopy, Dislocation density

Journal Articles

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao

J. Manuf. Sci. Eng. May 2021, 143(5): 051006.

Paper No: MANU-20-1189

DOI: https://doi.org/10.1115/1.4048637

Published Online: November 11, 2020

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Topics: Oscillations, Vibration, Wire, Semiconductor wafers, Slurries, Abrasive machining, Boundary-value problems

Journal Articles

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

Jingfei Yin, Qian Bai, Bi Zhang

J. Manuf. Sci. Eng. October 2019, 141(10): 101012.

Paper No: MANU-18-1639

DOI: https://doi.org/10.1115/1.4044417

Published Online: September 4, 2019

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Topics: Damage, Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics), Semiconductor wafers, Stress, Grinding

Journal Articles

Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning

Zhixiong Li, Dazhong Wu, Tianyu Yu

J. Manuf. Sci. Eng. March 2019, 141(3): 031003.

Paper No: MANU-18-1189

DOI: https://doi.org/10.1115/1.4042051

Published Online: January 17, 2019

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Topics: Algorithms, Modeling, Semiconductor wafers, Feature extraction, Physics

Journal Articles

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Bin Lin, Ping Zhou, Ziguang Wang, Ying Yan, Renke Kang, Dongming Guo

J. Manuf. Sci. Eng. December 2018, 140(12): 121001.

Paper No: MANU-18-1118

DOI: https://doi.org/10.1115/1.4041245

Published Online: September 17, 2018

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Topics: Cutting, Grinding, Grinding wheels, Semiconductor wafers, Surface roughness

Journal Articles

Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining

Kamlesh Joshi, Upendra Bhandarkar, Indradev Samajdar, Suhas S. Joshi

J. Manuf. Sci. Eng. September 2018, 140(9): 091001.

Paper No: MANU-17-1751

DOI: https://doi.org/10.1115/1.4039647

Published Online: June 4, 2018

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Topics: Damage, Semiconductor wafers, Wire, Electrical discharge machining

Journal Articles

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Ping Zhou, Ying Yan, Ning Huang, Ziguang Wang, Renke Kang, Dongming Guo

J. Manuf. Sci. Eng. August 2017, 139(8): 081012.

Paper No: MANU-16-1608

DOI: https://doi.org/10.1115/1.4036125

Published Online: May 10, 2017

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Topics: Deformation, Diamonds, Grinding, Semiconductor wafers, Stress, Wheels, Stress concentration, Damage, Silicon

Journal Articles

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

Shujuan Li, Aofei Tang, Yong Liu, Jiabin Wang, Dan Cui, Robert G. Landers

J. Manuf. Sci. Eng. April 2017, 139(4): 041003.

Paper No: MANU-16-1250

DOI: https://doi.org/10.1115/1.4034792

Published Online: October 18, 2016

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Topics: Cutting, Semiconductor wafers, Wire, Machining, Modeling, Diamonds

Journal Articles

Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper

Hao Wu, Shreyes N. Melkote

J. Manuf. Sci. Eng. March 2016, 138(3): 034501.

Paper No: MANU-15-1058

DOI: https://doi.org/10.1115/1.4030763

Published Online: October 1, 2015

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Topics: Grippers, Semiconductor wafers, Stress, Vacuum, Solar energy

Journal Articles

Force Modeling and Control of SiC Monocrystal Wafer Processing

Shujuan Li, Siming Du, Aofei Tang, Robert G. Landers, Yang Zhang

J. Manuf. Sci. Eng. December 2015, 137(6): 061003.

Paper No: MANU-14-1309

DOI: https://doi.org/10.1115/1.4029432

Published Online: September 9, 2015

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Topics: Cutting, Semiconductor wafers, Wire, Machining, Control equipment, Surface roughness, Diamonds, Tension

Journal Articles

Thermal Modeling of Ultraviolet Nanoimprint Lithography

Bhavik C. Patel, Ankur Jain

J. Manuf. Sci. Eng. December 2013, 135(6): 064501.

Paper No: MANU-13-1184

DOI: https://doi.org/10.1115/1.4025564

Published Online: November 5, 2013

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Topics: Design, Lithography, Modeling, Nanomanufacturing, Semiconductor wafers, Temperature, Tradeoffs, Ultraviolet radiation, Thermal management, Heat

Journal Articles

Effect of Substrate Flexibility on the Pressure Distribution and Lifting Force Generated by a Bernoulli Gripper

X. Brun, S. N. Melkote

J. Manuf. Sci. Eng. October 2012, 134(5): 051010.

DOI: https://doi.org/10.1115/1.4007186

Published Online: September 10, 2012

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Topics: Air flow, Deformation, Grippers, Pressure, Semiconductor wafers, Modeling

Journal Articles

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

Chunhui Chung, Chad S. Korach, Imin Kao

J. Manuf. Sci. Eng. June 2011, 133(3): 031006.

DOI: https://doi.org/10.1115/1.4004137

Published Online: June 8, 2011

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Topics: Grinding, Surface roughness, Abrasives, Slurries, Semiconductor wafers, Particulate matter, Modeling

Journal Articles

PDE-Constrained Gaussian Process Model on Material Removal Rate of Wire Saw Slicing Process

Hongxu Zhao, Ran Jin, Su Wu, Jianjun Shi

J. Manuf. Sci. Eng. April 2011, 133(2): 021012.

DOI: https://doi.org/10.1115/1.4003617

Published Online: March 23, 2011

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Topics: Wire, Semiconductor wafers

Journal Articles

Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing

Chris Y. Yuan, David A. Dornfeld

J. Manuf. Sci. Eng. June 2010, 132(3): 030918.

DOI: https://doi.org/10.1115/1.4001686

Published Online: June 14, 2010

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Topics: Cycles, Emissions, Energy consumption, Flow (Dynamics), Manufacturing, Microelectronic devices, Semiconductor wafers, Sustainability, Thin films, Water

Journal Articles

A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers

Yue Jiao, Z. J. Pei, Shuting Lei, E. Stanley Lee, Graham R. Fisher

J. Manuf. Sci. Eng. November 2006, 128(4): 938–943.

DOI: https://doi.org/10.1115/1.2335860

Published Online: April 28, 2006

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Topics: Grinding, Semiconductor wafers, Wire

Journal citation

NARROW

Manuscript

Optical Metrology of Critical Dimensions in Large-Area Nanostructure Arrays With Complex Patterns

Face Turning of Single Crystal (111)Ge: Cutting Mechanics and Surface/Subsurface Characteristics

Precision Silicon Exfoliation Tool Design

Study on Controllable Thickness and Flatness of Wafer-Scale Nickel Shim in Precision Electroforming Process: Simulation and Validation

Influence of Precursor Concentration on Crystalline Quality of GaN Thin Films Grown on a Sapphire Wafer

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper

Force Modeling and Control of SiC Monocrystal Wafer Processing

Thermal Modeling of Ultraviolet Nanoimprint Lithography

Effect of Substrate Flexibility on the Pressure Distribution and Lifting Force Generated by a Bernoulli Gripper

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

PDE-Constrained Gaussian Process Model on Material Removal Rate of Wire Saw Slicing Process

Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing

A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers

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