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Keywords: power electronics
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
Published Online: September 8, 2021
...Sevket U. Yuruker; Raphael K. Mandel; Patrick McCluskey; Michael M. Ohadi To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2020, 142(5): 052901.
Paper No: HT-19-1436
Published Online: March 13, 2020
...Zhongchen Zhang; Michael Collins; Eric Lau; Chris Botting; Majid Bahrami Effect of anodization on the thermal performance of naturally cooled heat sinks in power electronic devices made of die-cast aluminum alloy A380 and machined aluminum alloy 6061 was investigated experimentally and numerically...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. July 2009, 131(7): 074502.
Published Online: April 30, 2009
...D. Sui; T. Kim; M. L. Xu; T. J. Lu The thermal characteristics of exit flow issued from an axial fan widely used for impingement cooling of power electronics are experimentally studied. A new fan configuration is proposed to improve the impingement cooling performance at the center of a uniformly...
