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Keywords: packaging
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Journal Articles
Article Type: Technical Papers
J. Heat Transfer. December 2003, 125(6): 1170–1177.
Published Online: November 19, 2003
... cooling packaging interface structure Contact Resistance Heat Transfer Interface Rheological Thermophysical Particle-laden polymeric thermal interface materials (TIM) are one of the most commonly used thermal interface materials in microprocessor cooling 1 2...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2003, 125(5): 896–903.
Published Online: September 23, 2003
...; revision received June 3, 2003. Associate Editor: G. Chen. 17 July 2002 03 June 2003 23 09 2003 heat conduction Boltzmann equation electron-phonon interactions packaging finite volume methods transistors Computational Conduction Heat Transfer Microscale Nanoscale...
Journal Articles
Article Type: Technical Notes
J. Heat Transfer. August 2003, 125(4): 734–739.
Published Online: July 17, 2003
... , “ A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages ,” ASME J. Heat Transfer , 120 , pp. 830 – 839 . Young , T. J. , and Vafai , K. , 1998 , “ Convective Cooling of a Heated Obstacle in Channel ,” Int. J. Heat Mass Transf. , 41 , pp. 3131 – 3148...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2002, 124(5): 881–890.
Published Online: September 11, 2002
... by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER . Manuscript received by the Heat Transfer Division August 28, 2001; revision received April 4, 2002. Associate Editor: F. B. Cheung. 28 August 2001 04 April 2002 11 09 2002 packaging cooling heat...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2001, 123(5): 969–975.
Published Online: February 27, 2001
... packaging. These TIMs are typically polymeric matrix loaded with highly conducting filler particles. The dwindling thermal budget has necessitated a better understanding of the thermal resistance of each component of the thermal solution. Thermal conductivity of these particle-laden materials is better...
Journal Articles
Article Type: Technical Notes
J. Heat Transfer. December 2001, 123(6): 1184–1189.
Published Online: February 22, 2001
... received by the Heat Transfer Division November 22, 1999; revision received February 22, 2001. Associate Editor: S. Sadhal. 22 November 1999 22 February 2001 heat conduction numerical analysis Contact Resistance Heat Transfer Interface Packaging Roughness Constructal Design...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2001, 123(5): 999–1005.
Published Online: February 20, 2001
... Transfer Division December 7, 1999; revision received February 20, 2001. Associate Editor: H. Bau. 07 December 1999 20 February 2001 cooling optimisation heat transfer entropy packaging design engineering Thermal Design Heat Transfer Pressure Loss Entropy Generation...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. August 2001, 123(4): 698–702.
Published Online: November 25, 2000
... finite volume methods vortices packaging Conjugate Finite Difference Heat Transfer Mixed Convection Radiation Interaction of different modes of heat transfer continues to be a topic of interest because of its application in several areas, like the cooling of electronic equipment...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. February 2001, 123(1): 105–112.
Published Online: July 12, 2000
... received, July 12, 2000. Associate Editor: A. Majumdar. 01 June 1999 12 July 2000 thermal resistance heat transfer scattering cryogenics contact resistance Conduction Contact Resistance Heat Transfer Packaging Scattering Solid-solid thermal boundary resistance...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1998, 120(4): 830–839.
Published Online: November 1, 1998
... and greases have also been implemented. This review article covers recent developments in heat sink designs and applications intended for high-end high-power dissipation systems. A review of recent studies of card effects in the thermal enhancement of electronic packages is also presented. In certain...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1998, 120(2): 342–347.
Published Online: May 1, 1998
... From Array of Flatpacks in a Channel Flow,” Proc. Fourth Annual International Electronics Packaging Society , Baltimore, pp. 318–326. Electronics Heat Transfer Packaging 06 August 1997 05 January 1998 05 12 2007 B. A. Jubran1 Department of Mechanical Engineering...
Topics: Heat transfer