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Keywords: integrated circuit packaging
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Journal Articles
Article Type: Research Papers
J. Heat Transfer. April 2010, 132(4): 041009.
Published Online: February 19, 2010
... integrated circuit interconnections integrated circuit packaging microchannel flow microprocessor chips refrigerants thermal management (packaging) two-phase flow 02 02 2009 25 09 2009 19 02 2010 19 02 2010 2010 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2007, 129(10): 1432–1444.
Published Online: February 23, 2007
... integrated circuit packaging thermal management (packaging) conjugate heat transfer thermal management microelectronics micro-fabrication microchannel liquid cooling Heat removal has become one of the key design challenges for microelectronics as the total thermal design power (TDP...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 2006, 128(11): 1159–1175.
Published Online: March 13, 2006
... to fail and/or shorten its useful life. dielectric liquids boiling graphite undercooling porous materials copper bubbles thermal management (packaging) integrated circuit packaging 11 08 2005 13 03 2006 2006 American Society of Mechanical Engineers ...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. September 2006, 128(9): 889–896.
Published Online: February 7, 2006
... refrigerants heat exchangers thermoelectric devices integrated circuit packaging 26 06 2005 07 02 2006 Temperature traces of the copper-foam cladded evaporator and the saturated vapor Focusing on the performance of the EAC, the temperature distributions for a “cold” start...
Journal Articles
Article Type: Article
J. Heat Transfer. January 2005, 127(1): 85–94.
Published Online: February 15, 2005
... refrigeration thermal management (packaging) thermal resistance cooling sensors integrated circuit packaging valves With the increased use of complementary metal-oxide-semiconductor (CMOS) chip technologies in today’s computers, cooling has now become a strong influence on computer performance 1...
Journal Articles
Article Type: Article
J. Heat Transfer. January 2005, 127(1): 95–100.
Published Online: February 15, 2005
... 2005 refrigeration thermal management (packaging) integrated circuit packaging cooling sensors mechanical contact With the strong move towards complementary metal-oxide-semiconductor (CMOS) chip technologies, cooling has now become a strong influence on computer performance 1...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. January 2006, 128(1): 93–99.
Published Online: February 10, 2005
... sequence. e-mail: ch.richter@tu-bs.de e-mail: lienhard@mit.edu 04 08 2004 10 02 2005 temperature control distributed parameter systems integrated circuit testing integrated circuit packaging thermal management (packaging) conduction control electronics heat...
Topics: Temperature
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. February 2003, 125(1): 164–174.
Published Online: January 29, 2003
... Electronics Heat Transfer Temperature thermal variables control temperature control distributed parameter systems integrated circuit design integrated circuit packaging 18 December 2001 09 September 2002 29 01 2003 Contributed by the Heat Transfer Division for publication...
Topics: Temperature
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. April 2002, 124(2): 375–382.
Published Online: October 18, 2001
... devices integrated circuit packaging Bubble Growth Heat Transfer Microscale Phase Change Transient Device miniaturization has been the technology driver in both semiconductor and microelectromechanical system (MEMS) research. As a result, heat dissipation has become a major problem...
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. April 2002, 124(2): 383–390.
Published Online: August 21, 2001
... 21 August 2001 boiling organic compounds cooling heat transfer rough surfaces monolithic integrated circuits integrated circuit packaging Boiling Devices Enhancement Finned Surfaces Heat Transfer Roughness Direct liquid cooling by use of dielectric liquids has been...