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Journal Articles

Equivalent Circuits for Exergy Flow in Thermodynamic Systems

Jordan D. Kocher, Shannon K. Yee
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2025, 147(2): 022901.
Paper No: HT-24-1167
https://doi.org/10.1115/1.4066696
Published Online: November 15, 2024
View Article titled, Equivalent Circuits for Exergy Flow in Thermodynamic Systems
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Topics: Circuits, Entropy, Exergy, Flow (Dynamics), Heat, Temperature, Thermal systems, Cycles
Includes: Supplementary data
Journal Articles

Experimental Analysis of a Bayonet Tube at Constant Wall Temperature Conditions Under Laminar, Transition, and Turbulent Flow

Nishant Singh, Ram Vinoy Sharma, Shalendra Kumar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 041802.
Paper No: HT-22-1400
https://doi.org/10.1115/1.4056662
Published Online: January 23, 2023
View Article titled, Experimental Analysis of a Bayonet Tube at Constant Wall Temperature Conditions Under Laminar, Transition, and Turbulent Flow
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Topics: Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Temperature, Turbulence, Uncertainty, Wall temperature
Journal Articles

Predicting Multi-Order Magnetic Polaritons Resonance in SiC Slit Arrays by Mutual Inductor–Inductor–Capacitor Circuit Model

Yanming Guo, Bo Xiong, Yong Shuai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2020, 142(7): 072801.
Paper No: HT-19-1529
https://doi.org/10.1115/1.4046532
Published Online: May 29, 2020
View Article titled, Predicting Multi-Order Magnetic Polaritons Resonance in SiC Slit Arrays by Mutual Inductor–Inductor–Capacitor Circuit Model
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Topics: Capacitors, Circuits, Electromagnetic fields, Inductors, Polaritons, Resonance, Phonons, Excitation
Journal Articles

Performance Analysis of Printed Circuit Heat Exchanger for Supercritical Carbon Dioxide

Jiangfeng Guo, Xiulan Huai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2017, 139(6): 061801.
Paper No: HT-16-1394
https://doi.org/10.1115/1.4035603
Published Online: February 28, 2017
View Article titled, Performance Analysis of Printed Circuit Heat Exchanger for Supercritical Carbon Dioxide
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Topics: Circuits, Entropy, Flow (Dynamics), Fluids, Heat conduction, Heat exchangers, Heat transfer, Supercritical carbon dioxide, Heat capacity, Temperature
Journal Articles

Tungsten Nanowire Metamaterials as Selective Solar Thermal Absorbers by Excitation of Magnetic Polaritons

Jui-Yung Chang, Hao Wang, Liping Wang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2017, 139(5): 052401.
Paper No: HT-16-1053
https://doi.org/10.1115/1.4034845
Published Online: February 7, 2017
View Article titled, Tungsten Nanowire Metamaterials as Selective Solar Thermal Absorbers by Excitation of Magnetic Polaritons
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Topics: Nanowires, Polaritons, Resonance, Solar energy, Tungsten, Wavelength, Metamaterials, Excitation, Circuits, Finite difference time-domain analysis
Journal Articles

Optimization of Printed Circuit Heat Exchanger Using Exergy Analysis

Sang-Moon Lee, Kwang-Yong Kim
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. June 2015, 137(6): 064501.
Paper No: HT-14-1071
https://doi.org/10.1115/1.4029849
Published Online: June 1, 2015
View Article titled, Optimization of Printed Circuit Heat Exchanger Using Exergy Analysis
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Topics: Circuits, Exergy analysis, Heat exchangers, Optimization, Heat transfer, Design, Exergy, Reynolds-averaged Navier–Stokes equations
Journal Articles

Heat in Computers: Applied Heat Transfer in Information Technology

Wataru Nakayama
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2014, 136(1): 013001.
Paper No: HT-13-1378
https://doi.org/10.1115/1.4025377
Published Online: October 21, 2013
View Article titled, Heat in Computers: Applied Heat Transfer in Information Technology
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Topics: Computers, Cooling, Design, Heat, Heat transfer, Temperature, Circuits, Hardware, Computational fluid dynamics, Flow (Dynamics)
Journal Articles

Fast Heating Induced Thermoacoustic Waves in Supercritical Fluids: Experimental and Numerical Studies

Nusair Hasan, Bakhtier Farouk
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2013, 135(8): 081701.
Paper No: HT-12-1229
https://doi.org/10.1115/1.4024066
Published Online: July 11, 2013
View Article titled, Fast Heating Induced Thermoacoustic Waves in Supercritical Fluids: Experimental and Numerical Studies
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Topics: Acoustics, Heating, Pressure, Supercritical carbon dioxide, Supercritical fluids, Temperature, Waves, Fluids, Circuits, Microphones
Journal Articles

Heat Transfer Performance for a Falling-Film on Horizontal Flat Tubes

X. F. Wang, P. S. Hrnjak, S. Elbel, A. M. Jacobi, M. G. He
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2013, 135(7): 072901.
Paper No: HT-11-1579
https://doi.org/10.1115/1.4023689
Published Online: June 6, 2013
View Article titled, Heat Transfer Performance for a Falling-Film on Horizontal Flat Tubes
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Topics: Drops, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Water, Temperature, Circuits
Journal Articles

Heat Transfer in Double U-Tube Boreholes With Two Independent Circuits

Parham Eslami-nejad, Michel Bernier
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2011, 133(8): 082801.
https://doi.org/10.1115/1.4003747
Published Online: May 3, 2011
View Article titled, Heat Transfer in Double U-Tube Boreholes With Two Independent Circuits
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Topics: Circuits, Flow (Dynamics), Fluids, Heat, Heat pumps, Heat transfer, Laplace transforms, Pipes, Temperature, Geothermal engineering
Journal Articles

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

Jae-Mo Koo, Sungjun Im, Linan Jiang, Kenneth E. Goodson
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 49–58.
https://doi.org/10.1115/1.1839582
Published Online: February 15, 2005
View Article titled, Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures
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Topics: Circuits, Convection, Cooling, Heat sinks, Microchannels, Temperature, Thermal resistance, Heat, Boiling, Flow (Dynamics)
Journal Articles

Experimental Study on Forced Convection Heat Transfer Inside Horizontal Tubes in an Absorption/Compression Heat Pump

Li Yong and, K. Sumathy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Notes
J. Heat Mass Transfer. October 2002, 124(5): 975–978.
https://doi.org/10.1115/1.1473142
Published Online: September 11, 2002
View Article titled, Experimental Study on Forced Convection Heat Transfer Inside Horizontal Tubes in an Absorption/Compression Heat Pump
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Topics: Absorption, Compression, Forced convection, Heat pumps, Heat transfer, Heat transfer coefficients, Water, Mass transfer, Vapors, Pressure drop
Journal Articles

Electric Network Representation of the Unsteady Cooling of a Lumped Body by Nonlinear Heat Transfer Modes

Francisco Alhama, Antonio Campo
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Notes
J. Heat Mass Transfer. October 2002, 124(5): 988–992.
https://doi.org/10.1115/1.1495520
Published Online: September 11, 2002
View Article titled, Electric Network Representation of the Unsteady Cooling of a Lumped Body by Nonlinear Heat Transfer Modes
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Topics: Circuits, Cooling, Forced convection, Natural convection, Heat transfer, Thermal radiation
Journal Articles

Heat Transfer in Fin Assemblies: Significance of Two-Dimensional Effects—A Reexamination of the Issue

L. C. Thomas
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 1999, 121(3): 748–752.
https://doi.org/10.1115/1.2826047
Published Online: August 1, 1999
View Article titled, Heat Transfer in Fin Assemblies: Significance of Two-Dimensional Effects—A Reexamination of the Issue
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Topics: Heat transfer, Circuits, Errors
Journal Articles

Thermoelectric Voltage at Metallic Point Contacts From Nonequilibrium Effects

K. Ito, K. Hijikata, K. Torikoshi, P. E. Phelan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1995, 117(4): 822–827.
https://doi.org/10.1115/1.2836297
Published Online: November 1, 1995
View Article titled, Thermoelectric Voltage at Metallic Point Contacts From Nonequilibrium Effects
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Topics: Circuits, Copper, Cryogenics, Electrons, Heat conduction, Heat flux, Heat transfer, Heating, Phonons, Silver
Journal Articles

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1995, 117(3): 574–581.
https://doi.org/10.1115/1.2822616
Published Online: August 1, 1995
View Article titled, Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits
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Topics: Electronic circuits, Heat conduction, Silicon-on-insulator, Temperature measurement, Circuits, Silicon, Temperature, Transistors, Cooling, Design
Journal Articles

Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips

K.-A. Park, A. E. Bergles
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1987, 109(1): 90–96.
https://doi.org/10.1115/1.3248074
Published Online: February 1, 1987
View Article titled, Natural Convection Heat Transfer Characteristics of Simulated Microelectronic Chips
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Topics: Boundary layers, Circuits, Heat transfer, Heat transfer coefficients, Natural convection, Printed circuit boards, Water
Journal Articles

The One-Dimensional Analysis of Fin Assembly Heat Transfer

M. Manzoor, D. B. Ingham, P. J. Heggs
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1983, 105(3): 646–651.
https://doi.org/10.1115/1.3245634
Published Online: August 1, 1983
View Article titled, The One-Dimensional Analysis of Fin Assembly Heat Transfer
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Topics: Circuits, Design, Energy dissipation, Fins, Flow (Dynamics), Heat, Heat transfer, Manufacturing
Journal Articles

Lower Plenum Voiding

D. Bharathan, G. B. Wallis, H. J. Richter
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1982, 104(3): 479–486.
https://doi.org/10.1115/1.3245118
Published Online: August 1, 1982
View Article titled, Lower Plenum Voiding
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Topics: Accidents, Circuits, Coolants, Emergencies, Flow (Dynamics), Hydrodynamics, Pressurized water reactors, Reactor vessels, Steam, Vessels
Journal Articles

Behavior of Inert Gas Bubbles in Forced Convective Liquid Metal Circuits

W. J. Minkowycz, D. M. France, R. M. Singer
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1976, 98(1): 5–11.
https://doi.org/10.1115/1.3450470
Published Online: February 1, 1976
View Article titled, Behavior of Inert Gas Bubbles in Forced Convective Liquid Metal Circuits
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Topics: Bubbles, Circuits, Liquid metals, Liquid metal fast breeder reactors, Diffusion (Physics), Dynamics (Mechanics), Fluids, Pressure, Sodium, Steady state