Abstract
The microchannel flow boiling cooling technology has excellent developmental potential in high heat flux electronic devices. Saturated flow boiling in a microchannel with V-shaped grooved pin fins is simulated using the volume of fluid (VOF) model. The working coolant is Novec649. The depth-to-width ratio β of a single groove is set as 0, 1, and 2, respectively. The results show that with the increase of β, the maximal average temperature of heated walls decreases, and at q = 100, 300, and 500 kW·m−2, the average temperature at β = 2 declined 1.5, 5.3, and 9.3 K, respectively, compared with that at β = 0. The corresponding pressure drops are decreased by 24%, 25%, and 24%, respectively. The corresponding heat transfer factor remarkably increases 14–40%. Moreover, the model with β = 1 has the superior heat transfer coefficient while the model with β = 2 has the best comprehensive heat transfer factor as a whole.