To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power levels increase. Traditional air-cooling approaches usually provide insufficient performance or require heavy and bulky heat sinks to achieve adequate thermal management. To address this problem, a novel air cooled vertically enhanced manifold microchannel system (VEMMS) was developed. While minimizing the footprint required on the printed circuit board, the system offers efficient thermal management in a conformal scheme that accommodates the associated power electronics and their electrical connections. This work describes the manufacturing process of the air-cooled VEMMS heat sink and its experimental characterization and thermo-fluidic performance. Good agreement was obtained between the test results and numerical predictions. Using air at ambient conditions, thermal resistance of 2.6 K/W was achieved with a single-sided cooling architecture with a <1.5 cm2 footprint and <2 cm3 total heat sink volume. A full-bridge electrical power density of ∼84 kWe/L and overall direct current (DC–DC) converter power density of ∼20 kWe/L were achieved at reasonable flow rates and pressure drops using commercially available miniature electric fans.