A theoretical approach based on gaskinetic theory is described and applied for the modeling of steady-state free-molecule gaseous heat conduction within a diffusive enclosure. With a representative model of microelectromechanical system (MEMS) devices with integrated heaters, the heat transfer between the heated component and its gaseous ambient enclosed in a high vacuum is studied in detail. A molecular simulation based on the direct simulation Monte Carlo (DSMC) method is also employed to validate the theoretical solutions and to study the effects of incomplete thermal accommodation. The impacts of the finite size of the heated beam as well as the gap between the beam and a substrate on the heat transfer are investigated to examine the appropriateness of the common assumptions employed in the modeling of Pirani sensors. Interesting phenomena that are unique in the free-molecule regime are observed and discussed. These studies are valuable to the design of MEMS devices with microheaters.
Skip Nav Destination
e-mail: mewye@ust.hk
Article navigation
Research Papers
Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum
Taishan Zhu,
Taishan Zhu
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
Search for other works by this author on:
Wenjing Ye
e-mail: mewye@ust.hk
Wenjing Ye
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
Search for other works by this author on:
Taishan Zhu
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
Wenjing Ye
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
e-mail: mewye@ust.hk
J. Heat Transfer. May 2012, 134(5): 051013 (6 pages)
Published Online: April 13, 2012
Article history
Received:
April 26, 2010
Revised:
August 25, 2010
Published:
April 11, 2012
Online:
April 13, 2012
Citation
Zhu, T., and Ye, W. (April 13, 2012). "Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum." ASME. J. Heat Transfer. May 2012; 134(5): 051013. https://doi.org/10.1115/1.4005704
Download citation file:
Get Email Alerts
Cited By
Effect of Rib Blockage Ratio and Arrangements on Impingement Heat Transfer in Double-Wall Cooling
J. Heat Mass Transfer (September 2023)
Numerical Simulation of Mixed Convection Cooling of Electronic Component Within a Lid-Driven Cubic Cavity Filled With Nanofluid
J. Heat Mass Transfer (September 2023)
Experimental Analysis of the Influential Factors on Mixed Convection Flow in Horizontal Pipes
J. Heat Mass Transfer (September 2023)
The Effect of Biot Number on a Generalized Heat Conduction Solution
J. Heat Mass Transfer
Related Articles
Multicomponent Energy Conserving Dissipative Particle Dynamics: A General Framework for Mesoscopic Heat Transfer Applications
J. Heat Transfer (March,2009)
The Coupling of Conduction With Laminar Natural Convection From a Vertical Flat Plate With Arbitrary Surface Heating
J. Heat Transfer (August,1970)
Evaporation Heat Transfer in Sintered Porous Media
J. Heat Transfer (August,2003)
Thermal Performance of a Heat Storage Module Using PCM’s With Different Melting Temperatures: Mathematical Modeling
J. Sol. Energy Eng (May,1989)
Related Proceedings Papers
Related Chapters
Introduction
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment, Second Edition