Heat transfer across metal-dielectric interfaces involves transport of electrons and phonons accomplished either by coupling between phonons in metal and dielectric or by coupling between electrons in metal and phonons in dielectric. In this work, we investigate heat transfer across metal-dielectric interfaces during ultrafast-laser heating of thin metal films coated on dielectric substrates. By employing ultrafast-laser heating that creates strong thermal nonequilibrium between electrons and phonons in metal, it is possible to isolate the effect of the direct electron–phonon coupling across the interface and thus facilitate its study. Transient thermo-reflectance measurements using femtosecond laser pulses are performed on Au–Si samples while the simulation results based on a two-temperature model are compared with the measured data. A contact resistance between electrons in Au and phonons in Si represents the coupling strength of the direct electron–phonon interactions at the interface. Our results reveal that this contact resistance can be sufficiently small to indicate strong direct coupling between electrons in metal and phonons in dielectric.
Skip Nav Destination
e-mail: xxu@purdue.edu
Article navigation
Research Papers
Heat Transfer Across Metal-Dielectric Interfaces During Ultrafast-Laser Heating
Liang Guo,
Liang Guo
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907
Search for other works by this author on:
Stephen L. Hodson,
Stephen L. Hodson
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907
Search for other works by this author on:
Timothy S. Fisher,
Timothy S. Fisher
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907
Search for other works by this author on:
Xianfan Xu
Xianfan Xu
School of Mechanical Engineering and Birck Nanotechnology Center,
e-mail: xxu@purdue.edu
Purdue University
, West Lafayette, IN
47907
Search for other works by this author on:
Liang Guo
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907
Stephen L. Hodson
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907
Timothy S. Fisher
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907
Xianfan Xu
School of Mechanical Engineering and Birck Nanotechnology Center,
Purdue University
, West Lafayette, IN
47907e-mail: xxu@purdue.edu
J. Heat Transfer. Apr 2012, 134(4): 042402 (5 pages)
Published Online: February 13, 2012
Article history
Received:
May 18, 2011
Revised:
September 30, 2011
Online:
February 13, 2012
Published:
February 13, 2012
Citation
Guo, L., Hodson, S. L., Fisher, T. S., and Xu, X. (February 13, 2012). "Heat Transfer Across Metal-Dielectric Interfaces During Ultrafast-Laser Heating." ASME. J. Heat Transfer. April 2012; 134(4): 042402. https://doi.org/10.1115/1.4005255
Download citation file:
Get Email Alerts
Cited By
Entropic Analysis of the Maximum Output Power of Thermoradiative Cells
J. Heat Mass Transfer
Molecular Dynamics Simulations in Nanoscale Heat Transfer: A Mini Review
J. Heat Mass Transfer
Related Articles
Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique
J. Heat Transfer (March,2005)
A Study of the Effect of Surface Metalization on Thermal Conductivity Measurements by the Transient Thermo-Reflectance Method
J. Heat Transfer (December,2002)
Ultrafast Deformation in Femtosecond Laser Heating
J. Heat Transfer (April,2002)
Impact of Nonequilibrium Between Electrons and Phonons on Heat Transfer in Metallic Nanoparticles Suspended in Dielectric Media
J. Heat Transfer (December,2005)
Related Proceedings Papers
Related Chapters
What Property Do We Measure
Heat Transmission Measurements in Thermal Insulations
Thermal Design of a Miniature Guarded Hot Plate Apparatus
Insulation Materials: Testing and Applications, 3rd Volume
Resistance Mythology
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong