...Hsien-Chie Cheng; Yan-Cheng Liu This study presents a comprehensive assessment of the process-induced warpage of molded wafer for chip-first, face-down fan-out wafer-level packaging (FOWLP) during the fan-out fabrication process. A process-dependent simulation methodology is introduced, which...

...Hsiu-Ping Wei; Yu-Hsiang Yang; Bongtae Han A comprehensive stochastic model is proposed to predict Package-on-Package (PoP) stacking yield loss. The model takes into account all pad locations at the stacking interface while considering the statistical variations of the warpages and the solder ball...

...) as the bottom package. The top and bottom packages are connected through 216 solder joints of 0.5 mm pitch in two peripheral rows. The warpage values of the top and bottom package are calculated by finite element analysis (FEA), and the corresponding probability of density functions (PDFs) are obtained...

... Tonapi. 22 07 2013 11 04 2014 Electronic packaged devices are becoming increasingly smaller in size and higher in density while requiring higher performance and superior reliability. Warpage is one of the crucial factors for the thermomechanical reliability of electronic packages...

...Yu-Tang Yen; Te-Hua Fang; Yu-Cheng Lin This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried out by utilizing a combination of process parameters based...

... ultrafine pitch interconnection, while ACF just reaches the limit of 30 μ m . For NCF interconnection technology used in COG bonding, it needs a higher bonding pressure and temperature than those in ACF bonding, so the warpage is very important for the reliability of the package. In this paper, an exploring...

... processes, on flip chip packaging. The warpage of the package was examined, and the value of this during three different underfill encapsulating processes was measured. In addition, the interconnect reliability of the bump bonds after thermal-cycling was evaluated using a test circuit. The warpage...

...Shiang-Yu Teng; Sheng-Jye Hwang Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was neglected. A new approach considering both cure- and thermal-induced...

.... A numerical model for surface tension is outlined and validated with closed-form solutions. The results of the numerical model are compared to other known solder joint shape prediction methods. The effects of package weight, coplanarity, warpage, paste volume, pad misregistration, and joint construction...