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Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
DOI: https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
...Ralf Döring; R. Dudek; S. Rzepka; L. Scheiter; E. Noack; B. Seiler A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” Here, a virtual flip chip ball grid array (FC-BGA) is examined in comparison...
View Article titled, Design Optimization by <span class="search-highlight">Virtual</span> <span class="search-highlight">Prototyping</span> Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles