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Keywords: transient thermal management
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
Published Online: July 7, 2022
... ,
S.
,
Niedbalski ,
N.
, and
Boteler ,
L.
, 2020 , “
A System to Package Perspective on Transient Thermal Management of Electronics ,” ASME J. Electron. Packag. ,
142 ( 4 ), p. 041111 . 10.1115/1.4047474 [3]
Raghavan ,
A.
,
Luo ,
Y.
,
Chandawalla...
