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Keywords: tolerance analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
Published Online: December 15, 2003
..., thickness), the chip dimensions (area array configuration), and the parameters defining the solder joint geometry (substrate and chip pad diameter, solder volume). The first study analyzes how the solder joint geometry influences the CSP reliability. A second study is a tolerance analysis for six parameters...
