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Keywords: thermal management (packaging)
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High temperature rise or steep temperature gradients within silicon chips often...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
... 24 05 2011 16 09 2011 09 12 2011 09 12 2011 cooling forced convection liquid metals thermal management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
Published Online: December 9, 2011
... management strategies in 3D stacks. 3D chip stacks thermal management through-silicon-vias (TSVs) 3D integration integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 2011 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
Published Online: December 9, 2011
... 2011 09 12 2011 minimisation thermal management (packaging) thermal resistance Constructal theory is the view that the generation of flow configurations is a physics phenomenon that can be based on a physics principle (the Constructal law). According to this statement...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
Published Online: December 9, 2011
... drilling thermal management (packaging) thermoelectric devices Further investigations were made for the steady state chip temperature at surrounding temperatures up to 250 °C (Fig. 19 ). Steady state temperature of the chip for the water side (cold) and air side (hot) heat transfer...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
... bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging) conjugate uniform heat flux gas slip flow long microchannel Microchannel flows have drawn wide attention over the past decade due to the growing interest...
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Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... 30 09 2010 14 01 2011 09 03 2011 09 03 2011 arrays brightness computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) To quantify illuminance nonuniformity...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
... for the layout 13 10 2009 02 12 2010 09 03 2011 09 03 2011 computational fluid dynamics computer centres cooling electric conduits thermal management (packaging) Figure 1 demonstrates air flow patterns in a typical raised floor data center. In this type...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
Published Online: March 3, 2011
... and initial guess, which are typical issues in optimization of a large number of variables. 22 02 2010 12 11 2010 03 03 2011 03 03 2011 computational fluid dynamics electronics packaging natural convection thermal analysis thermal management (packaging) DELPHI...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
Published Online: September 30, 2010
... and testing process. This experiment evaluates the package reliability due to heat and moisture. 16 11 2009 06 07 2010 30 09 2010 30 09 2010 bonding processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
Published Online: September 9, 2010
... scenarios, compared with a baseline design. 23 12 2009 24 02 2010 09 09 2010 air conditioning computer centres cooling power consumption thermal management (packaging) data center energy efficiency coordinated optimization IT power minimization workload distribution...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2010, 132(2): 024501.
Published Online: June 23, 2010
... reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global challenges because the demand for multitasking and faster computation is inversely proportional to the package size. This phenomenon has become...
Journal Articles