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Keywords: stress effects
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Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
.... 307 – 312 . fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography Many factors can affect...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 398–405.
Published Online: October 6, 2004
... packaging life testing solders electronics packaging cracks stress effects finite element analysis There are many types of thermal fatigue models for determining the solder joint reliability of electronic packages, each with its own merits 1 . These models are dependent on package-level...
Journal Articles
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
Published Online: December 12, 2002
...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...
Journal Articles
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 61–66.
Published Online: December 12, 1999
.... 08 November 1999 12 December 1999 packaging thermal stresses delamination cracks stress effects thermal management (packaging) The presence of dissimilar material systems and thermal gradients introduce thermal stresses in multi-layered electronic assemblies and packages...